Infineon Technologies AG is expanding its CoolSiC MOSFET 650V G2 portfolio with 75 mΩ variants designed for compact power systems. The devices are available in TOLL, ThinTOLL 8×8, TOLT, D2PAK, TO247-3, and TO247-4 package options, supporting both Top Side Cooling and Bottom Side Cooling approaches for switching mode power supplies in AI servers, renewable energy systems, electric vehicle chargers, humanoid robot chargers, televisions, and drive applications.
The CoolSiC MOSFETs utilize second-generation CoolSiC technology with modified figures of merit and reliability characteristics compared to the previous generation. TOLL and ThinTOLL 8×8 packages provide thermal cycle stability on PCBs and reduce space requirements in SMPS applications while lowering manufacturing costs at the system level. The TOLT package addition expands Infineon’s TSC product family, which includes CoolMOS 8, CoolSiC, CoolGaN, and Optimos technologies.
TSC variants enable up to 95 percent direct heat dissipation and allow designers to utilize both sides of the PCB, reducing parasitic effects and improving space utilization. The CoolSiC MOSFETs 650V G2 75 mΩ devices are available now across all six package configurations.
