Cree, Inc. has introduced its latest breakthrough in SiC power device technology: the industry’s first 900V MOSFET platform. Optimized for high frequency power electronics applications, including renewable energy inverters, electric vehicle charging systems, and three-phase industrial power supplies, the new 900V platform enables smaller and higher efficiency next-generation power conversion systems at cost parity with silicon-based solutions.
“As a technology leader in SiC power, we’re committed to breaking the performance barriers that really matter to the power conversion design community,” said Dr. Cengiz Balkas, vice president and general manager, Cree Power and RF, “When compared to equivalent silicon MOSFETs, this breakthrough 900V platform enables a new market for our products by broadening the power range we can address in end systems. Following our 1200V MOSFETs, which exhibit superior performance to high voltage IGBTs, we are now able to outperform lower voltage superjunction silicon MOSFET technology at 900V. This platform delivers vastly superior characteristics, thereby providing power designers with the potential to innovate smaller, faster, cooler, and more efficient power solutions. Without question, it is beyond the reach of anything currently achievable with silicon.”
Built on Cree’s industry–leading SiC planar technology, the new 900V MOSFET platform expands the product portfolio to address design challenges common to new and evolving application segments in which a higher DC link voltage is desirable. The lead product (C3M0065090J) features the lowest on-resistance rating (65mΩ) of any 900V MOSFET device currently available on the market. Moreover, in addition to the industry standard TO247-3 and TO220-3 packages, the new device is also offered in a low-impedance D2Pak-7L surface mount package with a Kelvin connection to help minimize gate ringing.
Existing 900V silicon MOSFETs have severe limitations for high frequency switching circuits due to extremely high switching losses and poor internal body diodes. Further limiting the use of silicon MOSFETs is the Rds(on) that increases 3X over temperature, which causes thermal issues and significant derating. Alternately, Cree’s new 900V MOSFET technology delivers low Rds(on) at higher temperatures, enabling a significant size reduction of the thermal management system.
The C3M0065090J is rated at 900V/32A, with an RDS(ON) of 65mΩ at 25°C. At higher temperature operation (TJ = 150°C), the RDS(ON) is just 90mΩ. Packaged parts will be stocked through DigiKey & Mouser.
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