Peltier modules or thermoelectric coolers (TEC) have grown in popularity and found uses in many applications due their reliable solid-state construction and precise temperature control. They operate by transferring heat from one side of the module to the other when electrical power is applied. Although all Peltier devices are constructed using the same general structure, enhancements can be made to increase performance and cycle life.
CUI Devices’ arcTEC™ structure is one such advanced construction technique that utilizes three enhancements (thermally conductive resin, high temperature solder, and larger P/N elements) to greatly improve performance, reliability, and lifespan.
The CUI Insights™ blog post, “arcTEC™ Structure – Improved Performance and Longer Life in Peltier Modules” dives into these improvements in more detail, while providing an overview of Peltier module technology.