Bigger volumes for power semiconductors

Infineon used PCIM to say it’s scaling up volume production of its 1.2 kV CoolSiC MOSFETs. It also highlighted its XHP modules for IGBT high-power applications. Here, Infineon Industrial Power Control Div. president Peter Wawer holds an XHP 2 module during a press event. The modules use a special soldering technique called .XT joining said to eliminate backside delaminations that can otherwise arise after numerous power cycles.
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