APEC 2026: Infineon addresses AI data center power density challenges with TLVR quad-phase module

“We want to get rid of the dumb line frequency transformers. We want to move into more intelligent systems based on semiconductors.” Dr. Peter Friedrichs, ellow SiC Innovation and Industrialization, Infineon Technologies

At APEC 2026, Infineon Technologies presented a broad view of the power chain required to support AI infrastructure, from grid-level energy storage and solid-state transformers down to processor-level voltage regulation. The most specific product announcement was the TDM24745T, a quad-phase power module built around TLVR (trans-inductor voltage regulator) technology targeting AI server point-of-load applications.

The TDM24745T integrates four power stages, a TLVR inductor, and decoupling capacitors within a compact 9 × 10 × 5 mm³ package, achieving a current density exceeding 2 A/mm². The module supports high-current core rails for GPUs and AI processors in both lateral and vertical power delivery configurations, with a peak current capability of 320 A.

The TLVR architecture addresses a specific challenge in AI server power delivery: the need for very fast transient response as GPU workloads shift rapidly between load states. In a conventional multiphase buck design, transient performance is largely constrained by the output inductor, requiring large output capacitor banks to handle steep load steps. TLVR introduces magnetic coupling between phases, significantly extending control bandwidth without increasing the switching frequency. The TLVR architecture can reduce required output capacitance by up to 50 percent, helping system designers achieve more efficient, space-saving layouts.

The booth presentation also covered the broader transition underway in data center power architecture, particularly the shift toward high voltage DC distribution as rack power levels approach and exceed 500 kilowatts. Infineon showed two high-voltage IBC reference designs for 800 V input architectures, a new digital controller with pre-configured firmware for multiple topologies, and a family of point-of-load regulators delivering 20 A in a 3 × 3mm package using monolithic integration.

The TDM24745T is built on OptiMOS-6 MOSFET technology with chip-embedded magnetics.