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AI

Stackable power modules deliver up to 200 A vertical power

February 9, 2026 By Puja Mitra Leave a Comment

The FS1525 µPOL from TDK Corporation is a low-profile non-isolated DC-DC point-of-load power module delivering up to 25 A in a 7.65 x 6.80 mm footprint and just 3.82 mm height, designed for vertical power delivery directly beneath FPGA, SoC or ASIC devices. Based on 3D chip-embedded packaging, it integrates controller, MOSFETs, inductor and passives, […]

Filed Under: AI, Applications, Point of Load Tagged With: power module, tdkcorporation

Vertical power delivery reduces losses in AI processor designs

February 4, 2026 By Bill Pelletier, TDK Leave a Comment

GPUs, ASICs, and other AI processors require enormous amounts of power delivered at low voltages and high currents. Moving point-of-load DC-DC converters underneath those processors wastes less energy and provides cleaner power than having power components placed alongside loads. The semiconductor industry is approaching a transformative inflection point driven by the explosive growth of artificial […]

Filed Under: AI, AI Engineering Collective, Applications, FAQ, Featured, Featured Contributions Tagged With: AI, ASICs, GPUs, Vertical power delivery, VPD

150 A quad-channel IVR targets AI accelerator power rails

December 9, 2025 By Redding Traiger Leave a Comment

Endura Technologies has introduced the ET21324X, a quad-channel integrated voltage regulator intended for high-current point-of-load conversion in AI and high-performance compute platforms. The device is specified to deliver 150 A continuous output current with 220 A instantaneous capability and targets power rails that must hold regulation under rapid load steps from processors and accelerators. The […]

Filed Under: AI, Applications, Power Components, Power Management, Regulators Tagged With: enduratechnologies

MOSFET powers 48 V hot swap in AI servers

December 3, 2025 By Redding Traiger Leave a Comment

Alpha and Omega Semiconductor Limited announced its AOLV66935, a 100V High Safe Operating Area (SOA) MOSFET in an LFPAK 8×8 package. AOS’s latest MOSFET is designed as an ideal solution for 48V Hot Swap architectures in AI servers. The power demands of AI servers are intensifying, primarily driven by the increasing performance of the GPU/TPU. […]

Filed Under: AI, Applications, Development Tools, MOSFETS, Power Components Tagged With: alphaandomegasemiconductorlimited

Dual-voltage Flash offers faster program and erase performance

November 26, 2025 By Redding Traiger Leave a Comment

GigaDevice has introduced the GD25NX family of dual-voltage xSPI NOR Flash devices, designed with a 1.8 V core and 1.2 V I/O interface. The series connects directly to 1.2 V system-on-chip designs without requiring an external booster, reducing overall power consumption and component count. The GD25NX line builds on earlier 1.2 V I/O products and […]

Filed Under: AI, Applications, Automotive, Data center, Development Tools, Power Components, Power Management, Switches, wearables, Wearables Tagged With: gigadevice

TOLL-package MOSFETs support compact, high-power electronics

November 3, 2025 By Redding Traiger Leave a Comment

Magnachip Semiconductor Corporation has released two 650V Super Junction MOSFETs in a TO-Leadless (TOLL) package configuration. The devices are designed for high-power and high-current applications, including consumer electronics such as televisions, gaming monitors, and power adaptors. The new MOSFETs use a 4-pin Kelvin source configuration, which helps minimize parasitic inductance in the gate-source return path. […]

Filed Under: AI, Consumer electronics, Data center, Development Tools, MOSFETS, Power Components, Power Management Tagged With: magnachipsemiconductor

GaN-on-GaN design supports compact, efficient power conversion

October 31, 2025 By Redding Traiger Leave a Comment

Onsemi conductor has introduced a new generation of vertical gallium nitride (vGaN) devices featuring GaN-on-GaN architecture and designed to enhance power density, efficiency, and reliability in high-performance applications. Unlike lateral GaN structures built on silicon or sapphire substrates, the vertical configuration conducts current through the semiconductor material itself, enabling operation at higher voltages and switching […]

Filed Under: Aerospace, AI, Automotive, Data center, Development Tools, Industrial, Power Components, Power Management, Switches Tagged With: onsemiconductor

Modular GaN reference design scales to 108 kW configurations

October 22, 2025 By Redding Traiger Leave a Comment

Efficient Power Conversion Corporation has released a 5 kW AC-to-48 V DC reference design using enhancement-mode gallium nitride power devices. The system achieves 96.5% efficiency and 116 W/in³ power density while meeting Open Rack V3 size specifications. The design consists of two stages. The EPC91107KIT front-end stage converts 240 VAC to 400 VDC using a […]

Filed Under: AI, Data center, Development Tools, Power Components, Reference design Tagged With: efficientpowerconversioncorporation, GaN

Reference board delivers 12-kilowatt thermal design power with SiC JFET

October 15, 2025 By Redding Traiger Leave a Comment

Infineon Technologies AG has launched a 48-volt smart eFuse family and a reference board for hot-swap controllers designed for 400-volt and 800-volt power architectures in AI data centers. The products address power path protection requirements for high-power AI server systems operating at voltages from 48V to 400V and 800V. The eFuse ICs XDP730, XDP720, XDP721, […]

Filed Under: AI, Data center, Development Tools, Fuses, Power Components, Reference design Tagged With: infineontechnolgiesag

GaN-based device addresses megawatt-scale rack power delivery requirements

October 14, 2025 By Redding Traiger Leave a Comment

EPC introduced a gallium nitride-based power converter designed for 800 VDC distribution systems in AI data centers. The 6 kW converter transforms 800 V to 12.5 V using an Input Series Output Parallel topology. AI data centers require megawatt-scale rack power delivery systems. The GaN-based converter occupies under 5,000 square millimeters with a height of […]

Filed Under: AI, Converters, Data center, Development Tools, Power Components, Power Management Tagged With: epc

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Featured Contributions

How to design ultra-low-power smart thermostats without a C-wire

Vertical power delivery reduces losses in AI processor designs

Protecting Ethernet interfaces in telecommunications applications against common high energy surges

Ionic cooling: a silent revolution in thermal management

Robust design for Variable Frequency Drives and starters

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