Universal Chiplet Interconnect Express (UCIe) 3.0 is focused on increased bandwidth, improved power efficiency, and enhanced system-level management for next-generation chiplet-based designs. It’s designed to support artificial intelligence and high-performance computing while maintaining backward compatibility with UCIe 2.0 and 1.0. UCIe 3.0 continues to support 3D packaging. It doubles the bandwidth of UCIe 2.0 and […]
AI
Coolers stabilize laser temperature in 800 G to 3.2 T optical modules
Tark Thermal Solutions has introduced custom configurations in its OptoTEC MBX thermoelectric cooler series for optical transceivers operating at 800 gigabits per second, 1.6 terabits per second, and 3.2 terabits per second. The modules are designed for OSFP and QSFP-DD transceiver formats used in AI data centers and telecommunications infrastructure. The MBX series provides active […]
Dual-phase module delivers 140 A in 9 x 10 x 5 mm package
Infineon Technologies AG is launching the OptiMOS TDM22545T dual-phase power module, the industry’s first trans-inductance voltage regulator (TLVR) module specifically designed for high-performance AI data centers. The module’s proprietary TLVR inductance architecture minimizes the number of output capacitors, reducing the overall size of the voltage regulator (VR) and significantly lowering material costs (bill of materials; […]
Liquid-cooled switch delivers 102.4 Tbps switching capacity per chip
Alpha Networks Inc. announced the launch of its 1.6T liquid-cooled switch equipped with the Broadcom Tomahawk 6 chip to deliver up to 102.4 Tbps of switching capacity. Designed for AI/cloud data center and high-performance computing (HPC) applications, the product addresses high-speed connectivity requirements for generative AI, large-scale multimedia streaming, and Internet-of-Things deployments through a direct […]
12 kW reference design targets AI data centers
Infineon Technologies AG is introducing a 12 kW reference design for high-performance power supply units (PSUs), specifically designed for AI data centers and server applications. The reference design offers high efficiency and high-power density, and leverages all relevant semiconductor materials: silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). It is aimed at research and […]
Quarter-brick converters deliver 1300 W and 1600 W from 48 V to 12 V conversion
Advanced Energy Industries, Inc. announced expansion of its non-isolated bus converter (NIBC) family with two new quarter brick modules for 48 V power conversion in information and communication technology (ICT) equipment, including Artificial Intelligence (AI) server, compute, and networking, and in industrial applications such as robotics and test and measurement. The new Advanced Energy Artesyn […]
75 mΩ MOSFETs target AI servers and electric vehicle charging applications
Infineon Technologies AG is expanding its CoolSiC MOSFET 650V G2 portfolio with 75 mΩ variants designed for compact power systems. The devices are available in TOLL, ThinTOLL 8×8, TOLT, D2PAK, TO247-3, and TO247-4 package options, supporting both Top Side Cooling and Bottom Side Cooling approaches for switching mode power supplies in AI servers, renewable energy […]
Inductors support 125 °C operating temperature for high-speed data center communications
TDK Corporation has expanded its PLEC69B series of thin-film inductors, measuring 1.2 x 0.6 x 0.95 mm in length, width, and height, respectively. These components separate data signals from power in optical transceivers used in AI data centers, with mass production beginning in August 2025. The growing adoption of AI has increased demand for high-speed, […]
Schottky diodes feature merged PiN structure with zero recovery behavior
Nexperia announced the addition of two 1200 V 20 A silicon carbide (SiC) Schottky diodes to its continuously expanding portfolio of power electronics components. The PSC20120J and PSC20120L have been designed to address the demand for ultra-low power loss rectifiers, which enable high-efficiency energy conversion in industrial applications. As such, they are ideally suited for […]
MLCCs deliver 1 µF capacitance in 1.6 x 0.8 x 0.8 mm form factor
TDK Corporation has expanded its C series for commercial multilayer ceramic capacitors (MLCCs) to 1 µF at 100 V in the 1608 size (1.6 x 0.8 x 0.8 mm – L x W x H), with X7R characteristics. This is the industry’s highest capacitance* for a 100-V-rated product in this size and this temperature characteristic. […]
