Nexperia announced the NPS3102A and NPS3102B electronic fuses (eFuses) as the latest additions to its ever-expanding power device portfolio. These low-ohmic (17 mΩ), high current (13.5 A), and resettable electronic fuses help to protect downstream loads from exposure to excessive voltages while also protecting power supplies from load faults and large inrush currents. These eFuses […]
Data center
Latest SiC MOSFETs offer improved performance at lower cost per kW
onsemi has introduced its latest generation silicon carbide technology platform, EliteSiC M3e MOSFETs, to address the growing demand for electrification and renewable energy resources. The company plans to release multiple additional generations through 2030 to support global climate goals and the transition to electrification. The EliteSiC M3e MOSFETs are designed to improve performance and reliability […]
What are some design considerations for titanium AC-DC power supplies?
With the development of Energy Star Titanium efficiency power supplies, the power electronics industry has met the challenges of reducing data center energy consumption and supporting a greener society. What were those challenges, and is there a path to “more than Titanium” power supplies? High-efficiency power factor correction (PFC) and high-efficiency dc-dc conversion were key […]
Circuit breaker communicates with a host over SPI, collects data
STMicroelectronics has commenced production of automotive high-side power switches with proprietary intelligent fuse protection and a serial peripheral interface (SPI) for diagnostic data, permitting enhanced resilience and functional safety. The quad-channel VNF9Q20F is the first in a new family of monolithically integrated devices that combine ST’s advanced VIPower M0-9 MOSFET and proprietary STi2Fuse technology. Based on patented I2t […]
GaN device achieves 25 mΩ on resistance
Cambridge GaN Devices (CGD) has launched its lowest ever on-resistance (RDS(on)) parts which have been engineered with a new die and new packages to deliver the benefits of GaN to high-power applications such as data centers, inverters, motor drives, and other industrial power supplies. New ICeGaN P2 series ICs feature RDS(on) levels down to 25 mΩ, supporting […]
SiC MOSFETs optimized for AI, EV, and solar systems
Navitas Semiconductor announces the launch of their new Gen-3 ‘Fast’ (G3F) 650 V and 1,200 V SiC MOSFETs, designed for applications such as AI data center power supplies, on-board chargers (OBCs), fast EV roadside chargers, and solar/energy-storage systems (ESS). This new portfolio covers industry-standard packages from D2PAK-7 to TO-247-4, tailored for high-power, high-reliability applications. The G3F […]
GaN portfolio expanded to include high- and medium–voltage families
Infineon Technologies AG announces two new generations of high voltage (HV) and medium voltage (MV) CoolGaN devices which now enable customers to use Gallium Nitride (GaN) in voltage classes from 40 V to 700 V in a broader array of applications that help drive digitalization and decarbonization. These two product families are manufactured on high-performance […]
Flexible isolated gate driver for power-efficient designs
Allegro MicroSystems, Inc. announced the launch of the third product in its High Voltage Power-Thru portfolio. Allegro’s two-chip AHV85000 and AHV85040 isolated gate-driver IC solutions work together with external transformers to provide the freedom to design and maximize power efficiency for clean energy applications, including solar inverters, xEV charging infrastructures and energy storage systems (ESS), […]
Shielded inductors handle 90 A RMS
Bourns, Inc. introduced its new shielded power inductor series with extremely high current capability, low buzz noise ,and low DCR. A growing group of data-driven applications now require the support of power bead inductors that can match their exceptionally high current specifications. Bourns Model SRP1060VR Series Shielded Power Inductors meet these requirements for servers and workstations, data […]
High-current components with minimal footprint for immersion cooling applications
ITG Electronics has launched a line of narrow-body power beads for high-density applications where component space is at a premium. With a footprint of just 5X9mm and a height of 9.5mm, the company’s SLA36385A Series is ideal for data centers, primary motherboards for servers and storage devices, and other scenarios requiring components to offer high […]
