Infineon Technologies AG launches new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips. With the broad range of current classes from 300 A up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance. In addition to solar and drive applications, the portfolio […]
Automotive
Common-mode filters handle high-temp automotive apps
TDK Corporation announced the development of its KCZ1210AH series of miniaturized common-mode filters for automotive applications. The series is extremely compact, measuring 1.25 (L) x 1.0 (W) x 0.5 mm (H), which contributes to a smaller footprint on the substrate and provides a noise control function for different transmission signal lines for automobiles. With an […]
Automotive-compliant, current limit power switch can be set between 125mA and 1735mA
Diodes Incorporated introduces the AP22653Q programmable current limiting power switch. Streamlining power system design and assuring ongoing reliability, this automotive-compliant device provides a controlled and protected power path. It is rated to handle continuous load currents of up to 1.5A. Key applications include protection of vehicle USB ports and ECU supply rails, and infotainment and telematics […]
Miniature supercapacitors qualified for automotive uses
KEMET announces its new high-performance supercapacitors for automotive electronics, the FMD, and the FU0H series. This series delivers 1,000 hours at 85°C/85% RH-rated voltage and operating temperature ranging from -40°C to 85°C. The FMD series offers the highest lifetime with up to 4,000 hours. These supercapacitors are qualified for an automotive testing protocol. These capacitors […]
All-metal current-sense chip resistors feature 1-W power rating
IoT and Robotics require high efficiency and small size to maximize functionality. For current sensing, this means high power in small case sizes and low resistance values. The CSSH0805 from Stackpole is an all-metal chip resistor with a 1W power rating, resistance values down to 0.5 milliohms, and TCR ranging from 50 ppm to 100 […]
Totem-pole PFC reference design targets on-board EV chargers
VisIC Technologies Ltd. announces its new reference design for Totem Pole PFC aimed at OBC for electric vehicles. This reference design is another step in the ongoing effort to support our customers and improve the power conversion systems to fit the demanding size, cost, and efficiency targets for the automotive market. Today onboard-chargers embrace the […]
AEC-Q200 compliant fuses carry high dc voltage rating
Bel Fuse-Circuit Protection announced the 0ACH Series of fast-acting, high current SMD brick fuses. The series offers high current ratings and high interrupting ratings within a small package size of 4.5 x 4.5 x 12.3 mm. The 0ACH Series is designed for automotive and other applications which require a high current fuse, and where any […]
PMICs power high-performance automotive AI SoCs
Dialog Semiconductor plc announces the release of the DA914X-A product family of extremely efficient, high current, automotive grade, step-down DC-DC (Buck) converters. The DA914X-A devices deliver unprecedented current levels, up to 40 amps, a significantly better alternative to power solutions that require a combination of a power controller and discrete FETs. The DA914X-A family integrates […]
ESD protection diode in SOT package offers low capacitance and leakage current
Vishay Intertechnology, Inc. released a new bidirectional asymmetrical (BiAs) single-line ESD protection diode in the compact new DFN1006-2A package with side-wettable terminals. Saving space over solutions in SOT packages, the Vishay Semiconductors VCUT0714BHD1 offers low capacitance and leakage current for the protection of high-speed data lines against transient voltage signals. With its working voltage range […]
Advanced power electronics packaging
The trends in advanced power electronics packaging mirror the overall packaging trends in the electronics industry. Those trends include adopting chip-scale packaging (CSP), 3D packaging, 3D printing (also called additive manufacturing), and advanced thermal management materials. These trends are being heavily influenced by the adoption of gallium-nitride (GaN) and silicon-carbide (SiC) wide bandgap power semiconductors […]