The transition from 12-V to 48-V power distribution deals with efficiency, thermal management, and system architecture challenges in high-power applications. This article examines engineering concepts for transitioning from 12-V to 48-V power systems, with a particular emphasis on energy losses, modifications to server backplanes, and the implementation of zonal architectures. Q: Why is the industry […]
FAQ
Vertical power delivery reduces losses in AI processor designs
GPUs, ASICs, and other AI processors require enormous amounts of power delivered at low voltages and high currents. Moving point-of-load DC-DC converters underneath those processors wastes less energy and provides cleaner power than having power components placed alongside loads. The semiconductor industry is approaching a transformative inflection point driven by the explosive growth of artificial […]
Bonding dissimilar materials in EV structures: challenges and adhesive solutions
To offset the weight of battery packs in electric vehicles (EVs), manufacturers are adopting multi-material strategies that integrate advanced high-strength steels, aluminum alloys, and carbon fiber-reinforced polymers (CFRP). This FAQ addresses the specific challenges this transition presents for assembly and how structural adhesives are emerging as an enabler for these complex systems. Q: Why is […]
How do I choose the right mechanical attachment for my heat sink?
Mechanical attachments for heat sinks depend on various factors, such as package type, pressure distribution, mechanical shock, vibrations, and geometry, to name a few. This FAQ discusses six mechanical attachments for heat sinks and the reasons why engineers should select them for specific cases. Q: What are the primary considerations for reliable screw mounting? A: […]
How do different winding architectures impact transformer leakage inductance and parasitic capacitance?
When it comes to high-frequency transformer design, the careful management of parasitic elements is essential to ensure converter efficiency. Parasitic self-capacitance and leakage inductance matter when associated with switching losses, electromagnetic interference, and resonance issues in power electronics. This article examines how specific turn progressions, ranging from U-Type to Serpentine and 3D-molded sector windings, impact […]
FAQ on Hot Swap: from “don’t dare do it” to “it’s now OK to do” part 3
Hot-swapping is now a standard feature for many plug-in boards; implementing it requires understanding power-management circuits and components. There is always more that can be added to ensure proper and reliable performance under arduous and mission-critical conditions. Q: What further can be done to ensure safe performance and no damage to the board being swapped? […]
FAQ on Hot Swap: from “don’t dare do it” to “it’s now OK to do” part 2
Designing a hot-swap controller is not trivial, as there are many conditions that must be acknowledged and addressed. The problem is aggravated by the increasing power and current levels of many of today’s boards — both are increasing dramatically — which puts severe current-handling and thermal strain on the current-pass MOSFET, which the high-level view […]
FAQ on Hot Swap: from “don’t dare do it” to “it’s now OK to do” part 1
It wasn’t that long ago that one of the strict rules when assembling a system or debugging it was simple: don’t plug or unplug anything — component, cable, board — with the power on. You were firmly instructed to shut off the power and only turn it back on when you were done with connecting […]
How do inverter switching strategies influence battery health?
Traditionally, power converter design for energy storage systems (BESS) normally focuses on conversion efficiency and total harmonic distortion. In these designs, the battery is often modeled as a simple dc voltage source with fixed capacity and resistance. However, when it comes to high-density BESS and electric vehicle architectures, the interaction between the inverter’s switching strategy […]
How to choose the right thermal interface for compact electronics
Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical engineers, selecting a thermal interface material (TIM) is a design parameter affecting the reliability of high-wattage CPUs, GPUs, and power converters. Therefore, engineers must balance trade-offs involving bond line thickness (BLT), surface wettability, dielectric requirements, and mechanical stress relief […]
