By Mike Zhu, Qorvo Soft switching in DC-DC converters reduces energy loss. SiC transistors allow for higher switching frequencies and, thus, smaller magnetics, which reduces heat. Efficiency and power density are both essential factors in the design of power converters. Every contributor to energy loss generates heat that needs removal by costly and power-hungry cooling […]
Heatsinks
Versatile BGA heat sinks offer improved thermal performance
CUI Devices’ Thermal Management Group announced the expansion of its line of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family now offers aluminum or copper material options, clean or black anodized material finishes, and adhesive or PCB mounting styles. All BGA heat sink models are conveniently measured under four conditions for […]
PTC inks target heat operating temperatures between 50° and 90°C
Heraeus Electronics introduces the PTC4900 Series Self-Regulating Heater Inks, a breakthrough in heater technology. These customizable PTC (Positive Thermal Coefficient) inks offer enhanced performance, expanded operating temperatures, and unparalleled customization options. Designed for precise temperature control, they are suitable for various applications, including EV battery heaters, ADAS heaters, flooring heaters, and cabin comfort heaters. Traditionally, […]
Thermal gap filler incorporates carbon fibers to boost conductivity, maintain flexibility
Sarcon CF210A is the newest Fujipoly thermal gap filler and incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. The carbon fibers allow for higher thermal conductivity (21 W/m•K) while remaining compliant. Sarcon CF210A’s compliance is closer to a much lower conductivity gap filler such as Sarcon PG25A. While the thermal […]
Pin fin, slant fin heat sinks offer economical device cooling
Advanced Thermal Solutions, Inc. (ATS) is now providing Pin and Slant Fin heat sinks made from lightweight, extruded aluminum to provide low-cost cooling solutions for many hot PCB components. Pin Fin sinks have a high-efficiency design that harnesses cooling airflow from any direction. They reliably perform in spatially constrained PCB layouts where the airflow direction […]
Better thermal management of eGaN FETs
A few simple thermal management guidelines can help conduct heat away from GaN FETs. Assaad Helou, Efficient Power Conversion Enhancement-mode gallium nitride (eGaN) FETs offer high power-density with ultra-fast switching and low on-resistance, all in a compact form factor. However, the power levels these high-performance devices provide can be limited by extreme heat-flux densities. If […]
BGA heatsinks dissipate up to 11.69 W at 75°C ΔT in natural convection
CUI Devices’ Thermal Management Group announced the continued expansion of its heat sinks product portfolio with the addition of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family supports a wide range of sizes from 8.5 mm x 8.5 mm up to 60 mm x 60 mm with profiles from 6 mm up to 25 […]
Form-in-place thermal gap filler contains no silicone
SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low-viscosity, silicone-free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of only 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.5 mm. This allows […]
Sager Electronics to handle Advanced Thermal Systems standard, DIY, tubed and custom cold plates
Standard, DIY, tubed, and custom liquid cold plates from Advanced Thermal Systems (ATS) are candidates for cooling high-powered electronics, IGBT modules, lasers, wind turbines, motor devices, automotive components, medical equipment, and other applications where air cooling is insufficient. Liquid cold plates ultimately cool power electronics by transferring heat to liquid that and then dissipating via […]
Low oil-bleed/specific-gravity gap filler pad material in sheets, custom shapes
Sarcon GR14B from Fujipoly is a low oil-bleed/specific-gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is a candidate for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thick, highly conformable gap […]
