Sarcon CF210A is the newest Fujipoly thermal gap filler and incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. The carbon fibers allow for higher thermal conductivity (21 W/m•K) while remaining compliant. Sarcon CF210A’s compliance is closer to a much lower conductivity gap filler such as Sarcon PG25A. While the thermal […]
Heatsinks
Pin fin, slant fin heat sinks offer economical device cooling
Advanced Thermal Solutions, Inc. (ATS) is now providing Pin and Slant Fin heat sinks made from lightweight, extruded aluminum to provide low-cost cooling solutions for many hot PCB components. Pin Fin sinks have a high-efficiency design that harnesses cooling airflow from any direction. They reliably perform in spatially constrained PCB layouts where the airflow direction […]
Better thermal management of eGaN FETs
A few simple thermal management guidelines can help conduct heat away from GaN FETs. Assaad Helou, Efficient Power Conversion Enhancement-mode gallium nitride (eGaN) FETs offer high power-density with ultra-fast switching and low on-resistance, all in a compact form factor. However, the power levels these high-performance devices provide can be limited by extreme heat-flux densities. If […]
BGA heatsinks dissipate up to 11.69 W at 75°C ΔT in natural convection
CUI Devices’ Thermal Management Group announced the continued expansion of its heat sinks product portfolio with the addition of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family supports a wide range of sizes from 8.5 mm x 8.5 mm up to 60 mm x 60 mm with profiles from 6 mm up to 25 […]
Form-in-place thermal gap filler contains no silicone
SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low-viscosity, silicone-free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of only 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.5 mm. This allows […]
Sager Electronics to handle Advanced Thermal Systems standard, DIY, tubed and custom cold plates
Standard, DIY, tubed, and custom liquid cold plates from Advanced Thermal Systems (ATS) are candidates for cooling high-powered electronics, IGBT modules, lasers, wind turbines, motor devices, automotive components, medical equipment, and other applications where air cooling is insufficient. Liquid cold plates ultimately cool power electronics by transferring heat to liquid that and then dissipating via […]
Low oil-bleed/specific-gravity gap filler pad material in sheets, custom shapes
Sarcon GR14B from Fujipoly is a low oil-bleed/specific-gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is a candidate for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thick, highly conformable gap […]
Convection cooling components
Convection cooling is used in various devices, from mobile phone handsets to various consumer, communications, and industrial systems where the thermal loading is not too demanding. Devices such as heatsinks, heat spreaders, and heat pipes are used to implement convection cooling. Convection cooling systems are often classified as either passive or active. Active cooling systems […]
Tube-shaped thermal interface material for hot transistors
Fujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating component. Once […]
Ultra-high performance heat sinks include active models with integral blowers
Advanced Thermal Solutions, Inc, ATS, now provides a family of ultra-high performance heat sinks for cooling high powered CPUs, GPUs, FPGAs and AI processors. This ultra-cool family includes active heat sinks with integral blowers, and passive heat sinks that use available airflow to provide thermal management. The active heat sinks, dualFLOW and quadFLOW are designed […]
