The first 650-V automotive GaN FET with an integrated driver, protection and active power management today earned its inventor, Texas Instruments, a 2021 LEAP Award. More than 100 entries were received for the annual competition which celebrates the most innovative and forward-thinking products serving the design engineering space. This year’s winners were chosen by an […]
Transistors
The evolution of smart MOSFET technologies
A review of MOSFET advances helps predict where the technology is likely to head. Ashita Mirchandani, Bastian Lang • Infineon Technologies The past 50 years have seen unprecedented changes enabled by technology. The trend will continue with emerging technologies such as e-mobility, the Internet of Things (IoT), artificial intelligence, connectivity and 5G. At the heart […]
Comparing IGBT and SiC MOSFET PIMs in solar inverters
Side-by-side performance comparisons can show where silicon-carbide excels in PV installations. Steven Shackell • onsemi According to the International Energy Agency, solar power (PV) installations are on track to reach an installed capacity of 3,300 TWh by 2030, a yearly growth rate of 15% from 2019. Installations will be a mix of micro, mini and […]
eGaN FETs support 48–12V- DC-DC circuits ranging from 500 W to 2 kW
The EPC2069 (1.6 mΩ typical, 40 V) eGaN FET is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input servers. Lower gate charges and zero reverse recovery losses enable high frequency operation of 1 MHz, and beyond, at high efficiency in a tiny 10.6 mm2 footprint for […]
GaN power transistors handle up to 3 kW
GaN Systems introduced two new transistors in the industry’s broadest portfolio of GaN power transistors. The transistors are packaged in a standard 8×8 mm PDFN package. The GS-065-011-2-L allows users to reduce the cost per watt of delivered powered in 45W to 150W applications and the GS-065-030-2-L is the first GaN product on the market that enables designers to get […]
Advanced power electronics packaging
The trends in advanced power electronics packaging mirror the overall packaging trends in the electronics industry. Those trends include adopting chip-scale packaging (CSP), 3D packaging, 3D printing (also called additive manufacturing), and advanced thermal management materials. In power electronics, these trends are being heavily influenced by the adoption of gallium-nitride (GaN) and silicon-carbide (SiC) wide […]
Power bipolar transistors handle up to 8 A and 100 V
Nexperia announced nine new power bipolar transistors, extending its portfolio of products in the thermally and electrically advantageous DPAK package to cover applications from 2 A to 8 A and from 45 V up to 100 V. The new MJD series parts are pin-to-pin compatible with other MJD devices in DPAK-package, and they also offer significant […]
