Efficient Power Conversion Corp. advances the performance capability while lowering the cost of off-the-shelf gallium nitride transistors with the introduction of the EPC2045 (7 mΩ , 100 V) and the EPC2047 (10 mΩ , 200 V) eGaN FETs.
Widening the performance/cost gap with equivalent silicon power transistors, the EPC2045, cuts the die size in half compared to the prior-generation EPC2001C eGaN FET. The EPC2047 eGaN FET also cuts the size in half so that it is now about 15 times smaller than equivalently rated silicon MOSFETs.
Applications for the EPC2045 include single stage 48 V to load Open Rack server architectures,point-of-load converters, USB-C, and LiDAR. Wireless charging, multi-level AC-DC power supplies, robotics, and solar micro inverters are example applications for the 200 V EPC2047.
Designers no longer have to choose between size and performance – they can have both. The chip-scale packaging of eGaN products handles thermal conditions far better than the plastic packaged MOSFETs since the heat is dissipated directly to the environment with chip-scale devices, whereas the heat from the MOSFET die is held within a plastic package.