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Fairchild Semiconductor’s Dual Cool™ Package for DC-DC power

January 11, 2013 By scombest

Designers of DC-DC conversion applications are challenged with improving power density while saving board space and reducing thermal resistance. Fairchild Semiconductor’s mid-voltage PowerTrench® MOSFETs with Dual Cool™ packaging technology are well suited to help with these design challenges.

Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP.

Devices included in the mid-voltage series include the 40V FDMS8320LDC, 60VFDMS86500DC, 80V FDMS86300DC and the 100V FDMS86101DC. These devices are synchronous rectifying MOSFETs that are suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications.

Dual-Cool_FDMS8xxxxDC_3x3

Features and Benefits:

FDMS8320LDC (40V)

  • Max RDS(ON) = 1.1mΩ at VGS = 10V, ID = 44A
  • Max RDS(ON) = 1.5mΩ at VGS = 4.5V, ID = 37A

FDMS86500DC (60V)

  • Max RDS(ON) = 2.3mΩ at VGS = 10V, ID = 29A
  • Max RDS(ON) = 3.3mΩ at VGS = 8V, ID = 24A

FDMS86300DC (80V)

  • Max RDS(ON) = 3.1mΩ at VGS = 10V, ID = 24A
  • Max RDS(ON) = 4.0mΩ at VGS = 8V, ID = 21A
  • Industry’s lowest RDS(ON) by approximately 35% as compared to competitive solution with same voltage rating

FDMS86101DC (100V)

  • Max RDS(ON) = 7.5mΩ at VGS = 10V, ID = 14.5A
  • Max RDS(ON) = 12mΩ at VGS = 6V, ID = 11.5A

Fairchild Semiconductor
www.fairchildsemi.com

Filed Under: DC-DC, Power Components Tagged With: fairchildsemiconductor

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