Changing the “DNA” of superjunction MOSFET

In a time of consolidation in the power electronics market, it is interesting to see a startup. But Dallas-based D3 Semiconductor launched their line of superjunction MOSFETs with the idea of “changing the way superjunctions are designed,”
says Sr. VP of Sales and Marketing Scott Carson.

“What we’ve done is to take a longer view of the market,” says Carson. “We use our mixed-signal DNA as a company and will be infusing mixed- signal properties capabilities into superjunctions to make them more usable.”

“The way we see the market today,” says Carson, “is clusters of big companies with good technology and small companies with good technology. But with all the acquisitions, we see customers being left behind and we see a space here for a company of moderate size that can service a lot of these customers that don’t get much attention from the bigger guys. We’ve designed configurability into our process flow that gives more levers and knobs to our customers.”

D3 Semi’s initial product lineup provides extensive coverage for all power levels with Rds-On values ranging from 32mΩ to 1000mΩ.  Packages types include: traditional thru-hole (TO-220/TO-220FP), surface-mount (DPAK/D2PAK) and advanced surface-mount (5×6/8×8) devices. For all package sizes and ratings, D3 Semiconductor’s +FET devices exhibit a Qg RDS(ON) FOM (Figure of Merit) that is among the highest available.

More information – 650 V-rated superjunction MOSFETs boast smooth switching