Gallery: Cool tech demos at APEC2018, IEEE’s Applied Power Electronics Conference and Exposition

APEC summed up in one image

If there was a single theme to APEC, this top image from the GaN Systems booth might sum it up. Wide-bandgap semiconductors are diminishing the size of power supplies, including the bricks used to run laptop computers. The smaller bricks could be seen in several APEC booths. Indications are they will start hitting the market in the latter half of the year. Similar trends are apparent in power supplies for servers, middle. Helping the trend are devices such as the 100 V, 120 A, 5 mΩ GaN E-HEMT device [GS-010-120-1-T] and a 120 A, 650 V GaN E-HEMT (GS-065-120-1-D), sold as a die to customers building modules. GaN Systems also had an insulated metal substrate (IMS) evaluation platform (bottom), so named because it uses an IMS PCB (also known as a metal core/aluminum PCB) to cool the GaN E-HEMT power transistor modules configured as half-bridges.
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