High-voltage MLCCs deliver 47µF in 2220 package

KYOCERA AVX released the new DSCC 25007 Mini BME Stacks — miniature, high-CV stacked X7R capacitors equipped with base metal electrodes (BME) and subjected to 100% Group A testing.

Designed to satisfy the growing need for compact and lightweight high-CV SMT capacitors in high-reliability military, aerospace, and space applications subjected to extreme operating conditions and harsh environments, the new fully-tested and traceable DSCC 25007 Mini BME Stacks are based on its proven MIL-PRF-32535 X7R capacitors but are completely unique to the market.

The innovative series currently features two horizontally stacked X7R multilayer ceramic chip capacitors (MLCCs) in an EIA 2220 package that conserves board space, exhibits high-CV performance, and allows design engineers to downsize from currently available components. It also exhibits low ESR, low impedance, high current handling capabilities, and higher shock and vibration resistance than larger, heavier stacked capacitors. Additional features include a variety of lead frame options: standard two-foot J and L styles and paddle, or single bar foot, J and L styles optimized for improved vibration resistance — all equipped with tin/lead plating.

The initial release of the DSCC 25007 Mini BME Stacks is rated for operating temperatures extending from -55°C to +125°C and available with three voltage ratings (25, 50, and 100V) and nine capacitance values extending from 8.2–47µF ±20% tolerance.

Ideal applications for the series extend throughout the military, aerospace, and space industries and include satellites and satellite launchers, military missiles and aircraft, and input/output filtering circuits in power supplies.

The new DSCC 25007 Mini BME Stacks are manufactured in a DLA-approved, MIL-PRF-32535 qualified facility and are fully traceable and subjected to rigorous testing to ensure high reliability and performance in extreme conditions and harsh environments — specifically 100% Group A testing or 100% Group A and Group B testing for especially demanding designs with T-level requirements. Parts ship in waffle pack, tape and reel, or two-chip packaging.

Future expansions to the series will include a three-chip horizontal stack projected to launch by Q1 2026 followed by parts with three to 10 vertically stacked chips.