Infineon Technologies has expanded its collaboration with Anker to support the development of compact high-power chargers capable of delivering up to 160 W. The latest result of this partnership is Anker’s 160 W Prime Charger, which incorporates Infineon’s XDP digital control technology and CoolGaN-based power devices. The charger achieves high power density in a credit-card-sized housing, addressing the demand for portable high-output charging solutions.
The charger integrates Infineon’s hybrid-flyback digital combo controller, the XDP XDPS2221E, which manages power factor correction and hybrid-flyback stages to maintain efficiency while reducing overall size. The system is designed to supply up to 140 W from any single USB-C port and distribute 160 W across three connected devices. Additional components include the CoolGaN Drive 700 V G5 with an integrated driver and the CoolGaN Transistor Dual 650 V G5, which combines two GaN devices in one package to reduce board area and simplify layout.
Infineon reports that the combination of GaN switching technology, high-frequency operation, soft-switching, and digital regulation allowed engineers to increase power output within the same physical volume while reducing the number of external components. This approach is intended to improve power density, maintain reliability, and lower the bill-of-materials cost compared to earlier generations of high-power chargers.
The partnership between Infineon and Anker is supported by a joint Innovation Application Center in Shenzhen, which focuses on developing energy-efficient power-conversion systems and advancing fast-charging technologies. The center aims to accelerate design cycles and support ongoing work toward lower-carbon, high-efficiency consumer power products.
Additional information on the XDP XDPS2221E controller and Infineon’s CoolGaN power-device portfolio is available on the company’s website.
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