Rogers Corporation’s Power Electronics Solutions (PES) group has introduced its latest high-performance cooling material, curamik CoolPerformance Plus. curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and provide reliable thermal management of high-power laser diodes and other heat-generating optical devices.
CoolPerformance Plus coolers build upon the effective cooling approach employed in Rogers curamik CoolPerformance coolers. Both types of coolers feature several layers of pure copper, taking advantage of its excellent thermal conductivity. The copper foils are formed into hermetic, three-dimensional microchannel or macrochannel water-cooled structures capable dissipating large amounts of heat in small areas.
The new curamik CoolPerformance Plus coolers feature the addition of aluminum-nitride (AlN) isolation layers to proven curamik CoolPerformance copper cooling structures. The ceramic AlN layers separate the cooling water channels from the electrical contacts of laser diodes. They also provide a close match in coefficient of thermal expansion (CTE), in the range of 5 to 7 ppm/K, between the copper cooling structures and high-power ceramic laser diode packages for improved reliability even at high power levels.
The mounting surfaces of the new curamik CoolPerformance Plus coolers can be diamond-milled to meet the fine tolerances required for mounting of laser diode packages, for optimum flow of heat away from the diodes. Both curamik CoolPerformance and CoolPerformance Plus coolers provide more efficient cooling solutions than traditional liquid-cooled methods, and they can provide effective thermal-management solutions for laser diodes operating at power levels to 100 W or more.
curamik CoolPerformance and CoolPerformance Plus coolers are well suited for applications in industrial, medical, and research applications, for thermal management of high-power laser diodes and diode-pumped lasers.