Near-zero-CTE dielectric targets 224 Gb/s AI links

Advanced Chip and Circuit Materials, Inc. has released Celeritas HM50 and Celeritas HM001, PCB and substrate dielectric materials for AI and high-speed digital designs, with coefficients of thermal expansion of −8 ppm/°C and near-zero respectively, and low-loss performance for signal layers operating at 224 Gb/s and faster. HM50 is intended to reduce effective PCB stackup CTE by offsetting copper expansion, with finite element analysis on a large-format AI accelerator platform showing a 64% reduction in board warpage, an 81% reduction in package bow and more than 100× improvement in solder fatigue life versus a standard PCB. HM50 has a typical Dk of 3.55 and Df of 0.0055, while HM001 has a typical Dk of 2.90 and Df of 0.001, giving chip and package designers materials for managing thermomechanical mismatch and signal-integrity requirements in large AI assemblies.