Power modules meet extended HV-H3TRB reliability standards

The BZPACK mSiC® power modules from Microchip Technology are silicon carbide-based modules designed to meet High Humidity High Voltage High Temperature Reverse Bias standards for industrial and renewable energy power conversion applications. Available in half-bridge, full-bridge, three-phase and PIM/CIB configurations, the modules feature a CTI 600 V case, stable Rds(on) across temperature ranges and substrate options in Al₂O₃ or AlN for insulation and thermal performance. The modules use a baseplate-less design with Press-Fit terminals and optional pre-applied thermal interface material to simplify assembly and support system integration, while HV-H3TRB testing beyond 1,000 hours supports long-term reliability in demanding environments.