The first International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org), to be held June 13-15, 2016, in Raleigh, North Carolina, is now open for registration. The event is bringing together designers and manufacturers to address the future of integrated power electronics design and advance the 3D power electronics systems of the future.
The 3D-PEIM Symposium will kick-off on Monday morning, June 13th, with a series of tutorials dealing with “the world of packaging and critical issues” in 3D integration. Seminars will then continue over three days covering manufacturing techniques, modelling and simulation, materials, passive components, and quality and reliability. Evening receptions on Monday and Tuesday evening will provide opportunities for networking and discussions with vendors displaying the latest technologies.
The 3D-PEIM symposium is underwritten by the Power Sources Manufacturers Association (PSMA) and is supported by: the IEEE Components, Packaging and Manufacturing Technology Society (CPMT); the International Microelectronics Assembly and Packaging Society (IMAPS); North Carolina State University; the University of Maryland; and Virginia Tech.
PSMA
PSMA
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