New 1,200-V 400/600-A-rated full SiC power modules [BSM400D12P3G002/ BSM600D12P3G001] are optimized for inverters and converters in solar power conditioners, UPS, and power supplies for industrial equipment.
Developed by Rohm, the BSM600D12P3G001 can handle 600 A by utilizing a new package featuring an original internal structure and optimized heat radiation design, enabling support for higher power applications such as large-scale power supplies for industrial equipment. In addition, switching loss is reduced by 64% (at a chip temperature of 150°C) compared with IGBT modules at the same rated current, improving energy savings considerably. And along with reducing the size of peripheral components through high-frequency operation, the effects of reducing switching loss are greater when driving at high frequencies, contributing to the miniaturization of cooling and other systems. For example, from preliminary calculations based on loss simulation in cooling systems, adopting SiC modules can reduce the size of water-cooled heat sinks by up to 88%* compared with equivalently rated IGBT modules.
Loss simulations conducted with PWM inverter drives resulted in a 30% loss reduction with a 5 kHz PWM and an even more substantial reduction in total loss of 55% at 20 kHz PWM vs equivalently rated IGBT modules. In the case of 20 kHz operation the size of the heat sink can be reduced by 88%. High frequency drive also supports the use of smaller passive peripheral components.
Increasing the current rating of power modules also increases the surge voltage during switching, making it necessary to minimize inductance within the package. However, optimizing the internal placement of the SiC device along with terminal configuration and pattern layout allows a reduction of internal inductance by 23% vs conventional products. A new G Type package suppresses surge voltage by 27% at the same loss compared with standard packages, enabling the development of 400-A and 600-A modules.
By improving the flatness of the base plate section that significantly contributes to the heat dissipation of the module, there is a lessening of the thermal resistance between the cooling mechanism and the design’s base plate by 57%
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