Stackable power modules deliver up to 200 A vertical power

The FS1525 µPOL from TDK Corporation is a low-profile non-isolated DC-DC point-of-load power module delivering up to 25 A in a 7.65 x 6.80 mm footprint and just 3.82 mm height, designed for vertical power delivery directly beneath FPGA, SoC or ASIC devices. Based on 3D chip-embedded packaging, it integrates controller, MOSFETs, inductor and passives, supports 4.5 V to 16 V input and 0.6 V to 1.8 V output and scales to 200 A through stacking or paralleling for AI servers, edge computing and data center systems. With digital control via I²C and PMBus, true differential remote sensing and low ripple performance, the FS1525 targets power rails for advanced AI processors, SERDES and high-density computing platforms including PCIe, VPX, SMARC and rack-based systems.