Cambridge GaN Devices (CGD) has announced two new packages for the company’s ICeGaN family of GaN power ICs that offer enhanced thermal performance and simplify inspection. Variants of the well-proven DFN style, both packages are extremely rugged and reliable. Developed for CGD, the DHDFN-9-1 (Dual Heat-spreader DFN) is a thin, dual-side cooled package with a […]
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Cambridge GaN devices moves to support industrial applications
Cambridge GaN Devices (CGD) is addressing higher power industrial applications with its ICeGaN™ technology, which has already proved itself rugged, reliable, and easy to use in high-volume consumer devices. At the APEC 2024, IEEE Applied Power Electronics Conference and Exposition, the company is introducing new reference designs and showing demos that address the broad and […]
Boards let you try power devices in your circuits
Cambridge GaN Devices (CGD) has introduced a range of Application Interface Boards that allow designers to try out the company’s rugged, easy-to-use ICeGaN HEMTs in existing circuits in place of competing MOSFET or GaN devices without having to re-layout the PCB. Application Interface Boards are adaptor PCBs that are soldered to an ICeGaN device, which […]
