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cambridgegandevices

Power GaN devices minimize cooling needs

June 4, 2024 By Redding Traiger

Cambridge GaN Devices (CGD) has announced two new packages for the company’s ICeGaN family of GaN power ICs that offer enhanced thermal performance and simplify inspection.  Variants of the well-proven DFN style, both packages are extremely rugged and reliable. Developed for CGD, the DHDFN-9-1 (Dual Heat-spreader DFN) is a thin, dual-side cooled package with a […]

Filed Under: Development Tools, Power Components, power modules, Thermal management Tagged With: cambridgegandevices

Cambridge GaN devices moves to support industrial applications

February 28, 2024 By Emma Lutjen

Cambridge GaN Devices (CGD) is addressing higher power industrial applications with its ICeGaN™ technology, which has already proved itself rugged, reliable, and easy to use in high-volume consumer devices. At the APEC 2024, IEEE Applied Power Electronics Conference and Exposition, the company is introducing new reference designs and showing demos that address the broad and […]

Filed Under: APEC 2023, Featured, Industrial Tagged With: cambridgegandevices

Boards let you try power devices in your circuits

May 24, 2023 By Redding Traiger

Cambridge GaN Devices (CGD) has introduced a range of Application Interface Boards that allow designers to try out the company’s rugged, easy-to-use ICeGaN HEMTs in existing circuits in place of competing MOSFET or GaN devices without having to re-layout the PCB. Application Interface Boards are adaptor PCBs that are soldered to an ICeGaN device, which […]

Filed Under: Development Tools, Industrial, MOSFETS, Power Components Tagged With: cambridgegandevices

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