Fujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating component. Once […]
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Gel-like thermal gap filler pads feature low thermal resistance
Fujipoly recently released Sarcon GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with thermal conductivity of 13 W/m°K. Sarcon GR130A is available in five thicknesses (0.3, 0.5, 1.0, 1.5, and 2.0mm) up to a maximum dimension of 300mm x […]
Thin-film isolator material also helps manage heat
Fujipoly offers a large selection of thin-film, thermal interface materials. Available in eight formulations, these Sarcon materials offer versatility in managing heat dissipation while exhibiting useful characteristics such as electrical insulation, and UL94 VO flammability. The Sarcon series of thin films range in thickness from 0.15mm to 0.85mm. Depending on the material selected and application […]
Thermal interface caps available in standard sizes to fit many transistors
In an effort to streamline your manufacturing process and improve transistor cooling, Fujipoly offers a large assortment of box-shaped Sarcon thermal interface caps. These cases are available in standard sizes to fit many transistors and can be custom ordered to your exact specifications. Installation takes seconds by sliding over the heat-generating component. Once fitted, unwanted […]
Engineering Resource section offers thermal design technical content
Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful whitepapers and webinars as well as an extensive collection of Sarcon thermal interface material performance datasheets. The whitepapers cover topics such as the Compression Characteristics of Thermal Interface Gap Fillers, and Understanding the Fundamentals of […]
Low-compression-force gap-filler pads boost thermal efficiency of heat sinks
The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints as the […]
