xMEMS Labs, Inc. has announced the extension of its µCooling fan-on-a-chip technology into AI data centers, providing an in-module active thermal management solution for optical transceivers. Originally designed for compact mobile devices, the µCooling platform now addresses the thermal challenges faced by dense, thermally-constrained environments in high-speed optical transceivers, including those operating at 400G, 800G, […]
Inc.
COLE HERSEE’S HBW60 SEALED POWER DISTRIBUTION MODULE
The new HWB60 sealed power distribution module (PDM), a compact PDM ideal for use in space-constrained vehicle battery compartments has a 60-slot HWB60. It accepts plug-in circuit protection components with a 280-style footprint, including Delphi MetriPack 280 connectors, terminals, cable seals, and cavity plugs. Standing up to road splash and salt spray, it provides robust […]
