MagnaChip Semiconductor Corporation announced eight new 700V and 800V series high-voltage Super Junction Metal Oxide Semiconductor Field Effect Transistors (SJ MOSFETs), featuring high performance and efficiency and optimized for TV, LED lighting, and fast charger applications. MagnaChip began SJ MOSFET development in 2013. Cumulative shipments have now reached 1.5 billion units, and the company’s flagship […]
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LED driver ICs handle TV backlighting
MagnaChip Semiconductor Corporation announced the launch of two new LED Driver ICs for UHD TV BLU (Back Light Unit). The two new models are 1-channel and 2-channel products developed for mid-range UHD TVs. An essential component of LED display panels, a BLU LED Driver IC is a power semiconductor device that delivers consistent lighting across […]
MOSFET designed to protect battery overcharge in wireless earphones
MagnaChip Semiconductor Corporation announced that the company is entering the wireless earphone market with the introduction of a new MOSFET for wireless earphones for preventing the battery from overcharging. This MOSFET is designed to control excessive current flowing into wireless earphones while recharging the battery in order to protect wireless earphones from being damaged. Since […]
Third-gen 0.18-u Bipolar-CMOS-DMOS process technology excels at driver, charger, dc-dc conversion IC fab
MagnaChip Semiconductor Corporation announced it now offers foundry customers its third generation 0.18 micron Bipolar-CMOS-DMOS (BCD) process technology. The technology is highly suitable for PMIC, DC-DC converters, battery charger ICs, protection ICs, motor driver ICs, LED driver ICs and audio amplifiers. The third generation 0.18 micron BCD process technology offers improved specific on-resistance (Rsp) of power LDMOS […]
MOSFET delivers low total gate charge to industrial and lighting applications
MagnaChip Semiconductor Corporation announced the introduction of a new High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge (Qg) (90R1K4P). The device with two package types, I-PAK and D-PAK, will sample to customers in November 2018 and will be manufactured in high volume in early first quarter of next year. […]
