• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer
  • Subscribe
  • Advertise

Power Electronic Tips

Power Electronic News, Editorial, Video and Resources

  • Products
    • Power Supplies
    • AC-DC
    • DC-DC
    • Battery Management
    • Capacitors
    • Magnetics
    • MOSFETS
    • Power Management
    • RF Power
    • Resistors
    • Transformers
    • Transistors
  • Applications
    • 5G
    • AI
    • Automotive
    • EV Engineering
    • LED Lighting
    • Industrial
    • IoT
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • EE Training Days
    • FAQ
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • White Papers
  • Video
    • EE Videos & Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineeering Training Days
  • Newsetter Subscription

Tantalum polymer capacitors target high-capacitance, high-voltage apps

August 7, 2020 By Aimee Kalnoskas Leave a Comment

Tantalum polymer capacitorsKEMET continues to develop and design solutions for alternative energy, industrial/lighting, medical, defense and aerospace, and telecommunications applications with the new Tantalum Stack Polymer (TSP) O 7360-43 and the 82uF/75V rated voltage extension in Polymer Hermetically Sealed. The TSP series is designed to provide the highest capacitance/voltage (CV) ratings in surface mount device (SMD) capacitors with its innovative stacking construction. These new capacitors are well suited and sized for use in high voltage power management applications such as buck-boost converters, filtering, hold-up capacitors, and other high ripple current applications that require a small form factor, stable performance, and long operational lifespan.

KEMET’s KO-CAP High Reliability Series T540, T541 and T543 are all available for stack configuration in the TSP series. When stacked, these capacitors allow design engineers to customize for capacitance, voltage, and low ESR (equivalent series resistance). This feature makes the TSP series ideal for devices using Gallium Nitride (GaN) semiconductor technology, including radar applications based on the Active Electronically Scanned Array (AESA) systems. The TSP series also offers improved derating conditions and larger capacitance to ensure a low failure rate for typical voltage levels, as well as multiple failure rate options when utilizing Series T540 and T541 in a stack configuration.

The TSP series is qualified for numerous applications, including airborne, grounded, and naval equipment where GaN radio frequency (RF) semiconductors are part of the design. According to a May 2020 report from Yole Développement*, the total defense market for GaN radio frequency (RF) applications is expected to grow at a CAGR of 22% and surpass USD 1 billion in 2025, while the total GaN RF market will reach over USD 2 billion in 2025. The report also states that application in AESA systems for radar and demand for lightweight devices for airborne systems are the main drivers of the GaN RF defense market. Furthermore, the TSP series can fully support other high power, high frequency, and long-life requirement designs in telecommunications and industrial applications.

The tantalum polymer capacitors series is available immediately via KEMET distributors.

You may also like:

  • energy harvesting
    What’s new in electrolytic capacitors and supercapacitors for energy harvesting
  • molded power inductors
    What do molded power inductors bring to high efficiency, compact…
  • inductor cores
    How new inductor cores meet demands for smaller, quieter, and…

Filed Under: Capacitors, Power Components Tagged With: kemet

Reader Interactions

Leave a Reply

You must be logged in to post a comment.

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Primary Sidebar

Featured Contributions

Protecting Ethernet interfaces in telecommunications applications against common high energy surges

Ionic cooling: a silent revolution in thermal management

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

The case for vehicle 48 V power systems

More Featured Contributions

EE LEARNING CENTER

EE Learning Center

EE TECH TOOLBOX

“ee
Tech Toolbox: Connectivity
AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

EE ENGINEERING TRAINING DAYS

engineering
“power
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.
“bills

RSS Current EDABoard.com discussions

RSS Current Electro-Tech-Online.com Discussions

  • RC Electronic Speed Control Capacitors
  • Annex32 / Annex RDS For ESP Micros - A Quick and Dirty Example
  • Convenient audio FFT module?
  • CR2/CR123A Batteries In Projects
  • Harman Kardon radio module BMW noise

Footer

EE World Online Network

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Microcontroller Tips
  • Sensor Tips
  • Test and Measurement Tips

Power Electronic Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy