Rogers Corporation is pleased to introduce 92ML materials. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board.
The 92ML laminate materials are available with up to 4oz copper cladding; thick enough to meet today’s most demanding power distribution requirements. The high thermal conductivity of up to 3.5 W/mK (in-plane) in combination with the relative ease and familiarity of epoxy based systems makes this material an ideal candidate for applications such as motor controllers, power supplies, converters, automotive electronics, etc. The relatively high Tg value of 160°C in combination with a low Z-axis coefficient of thermal expansion of 22ppm/°C (
Additionally, 92ML laminates are also offered in combination with an aluminum plate to form an insulated metal substrate (IMS). This product is known as 92ML StaCool laminate. In this configuration, the product has an integrated heat sink that can be machined and formed to serve as a mechanical chassis in the final application. 92ML StaCool laminate is characterized as having a high level of thermally stable adhesion to the aluminum substrate. This laminate withstands over 7 minutes of 288°C solder exposure enabling sufficient time for final product to be assembled without issues. 92ML StaCool laminate is useful in high power and operating temperature applications such as LED modules, automotive lighting, power devices, etc.