TI introduces lowest latency, highest ESD industrial Gigabit Ethernet PHYs, enabling real-time Industry 4.0 applications

Texas Instruments (TI) (NASDAQ: TXN) introduced the industry’s lowest latency and highest electrostatic discharge (ESD) industrial Gigabit Ethernet physical layers (PHYs). The new family of six devices enables engineers to bring real-time industrial Internet of Things (IIoT) capabilities to rugged factory automation systems, motor drives, and test and measurement equipment. The new DP83867 family meets stringent electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards, reduces power consumption, and offers designers flexibility with multiple temperature, media access control (MAC) interface and packaging options. For more information, visit www.ti.com/dp83867-pr.

See the DP83867 in action in an Ethernet PHY demo in TI’s booth (No. 6-441) at the SPS IPC Drives conference, Nov. 24-26, in Nuremberg, Germany.

Key features and benefits of the DP83867 industrial Gigabit Ethernet PHYs

• Industry’s lowest latency: Latency is less than 400 nanoseconds (ns) at 1,000 Mbps and 100 Mbps – 50 percent better than the competition. This reduces controller cycle times, improving real-time performance of standard IEEE 802.3 Ethernet connections in industrial systems.
• Industry’s highest ESD protection: ESD protection exceeds 8 kV to surpass IEC 61000-4-2 standards, which is four times better than the competition. High ESD protection reduces the failure rate of Industry 4.0 systems by shielding against high-voltage faults.
• EMI mitigation: The DP83867 exceeds stringent standards for EMI/EMC from International Electrotechnical Commission (IEC), Comité International Spécial des Perturbations Radioélectriques (CISPR) and European Standards (EN). By exceeding the EN55011/CISPR11 Class B-level testing standards, the DP83867 gives designers more design headroom so that they can go to production faster.
• Power savings: Wake-on-local area network (LAN) (WoL) and power-down modes offer energy savings when the system is in a standby state. In addition, the DP83867 offers active power consumption of less than 460 mW, which is at least 30 percent lower than the competition.
• Scalability across the temperature range: The DP83867 family offers options that allow designers to design across the full temperature range from -40oC to 105oC. This enables designers to adapt one design for multiple temperature environments, from commercial to extended industrial temperatures.

Tools and support to speed design
Evaluation modules (EVMs) available today from the TI store and authorized distributors enable designers to quickly and easily evaluate the new devices. The DP83867IRPAP-EVM supports the gigabit media independent interface (GMII) and reduced GMII (RGMII) and is priced at US$199, and the DP83867ERGZ-R-EVM supports RGMII and is priced at $199. Designers can download IBIS models and the JTAG BSDL model to further speed evaluation.

Designers can jumpstart their design with the EMI/EMC-compliant industrial-temperature-grade Gigabit Ethernet reference design, which includes the Sitara™ AM335x processor with integrated Ethernet MAC and switch.

Engineers can search for solutions, get help, share knowledge, and solve problems with fellow engineers and TI experts in the TI E2E™ Community Ethernet forum.

Package, availability and pricing
The DP83867 industrial Gigabit Ethernet PHY family is available today with prices starting at US$4.40 in 1,000-unit quantities. Designers can select from two package options: a 48-pin quad-flat no-lead (QFN) package for space-constrained applications, and a 64-pin quad flat package (QFP) optimized for ease of use.

In addition to temperature grade options, several pin-to-pin compatible MAC interface options give designers flexibility to interface with various processors or field programmable gate arrays (FPGAs). These temperature and MAC interface options also help designers of non-industrial connected applications such as Internet Protocol (IP)-based network cameras, set-top boxes and computing applications meet the growing need for more rugged connectivity in their products.

TI
www.ti.com