Magnachip Semiconductor Corporation has released two 650V Super Junction MOSFETs in a TO-Leadless (TOLL) package configuration. The devices are designed for high-power and high-current applications, including consumer electronics such as televisions, gaming monitors, and power adaptors.
The new MOSFETs use a 4-pin Kelvin source configuration, which helps minimize parasitic inductance in the gate-source return path. This design reduces gate ringing and improves switching stability and efficiency compared with standard 3-pin configurations.
Compared with a conventional D2PAK package, the TOLL design provides more than twice the current-carrying capability, a 24% smaller footprint, and a 48% lower profile. These characteristics make it suitable for compact printed circuit boards and high-power-density systems that require efficient thermal management.
Magnachip’s existing TOLL portfolio includes 80V–200V eXtreme Trench MOSFETs using a 3-pin layout. The company plans to extend the new 650V TOLL family to support additional high-power applications, including future AI data center designs.
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