Thermal interface materials (TIMs) are placed between two mating surfaces, such as a power semiconductor module and a heat sink, to improve heat flow … [Read More...] about How do thermal interface materials help in power electronics cooling?
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Are SiC and GaN going to be replaced by ultra power semis?
With the recent announcement by Infineon that gallium nitride (GaN) use is reaching the “tipping point” for accelerated adoption, maybe it’s time to … [Read More...] about Are SiC and GaN going to be replaced by ultra power semis?
More Power Electronics News
GaNe-based controller achieves standby power below 30 mW
STMicroelectronics’ VIPerGaN65D flyback converter, with its SOIC16 outline, permits extremely small and economical power supplies, adapters, and USB-PD (Power Delivery) fast chargers up to 65W with … [Read More...] about GaNe-based controller achieves standby power below 30 mW
Hybrid flyback controllers reduce transformer size via lower leakage inductance
Infineon Technologies AG is introducing the E-version of its hybrid flyback controller family. Designed for high-performance applications, the new XDP hybrid flyback digital controller family … [Read More...] about Hybrid flyback controllers reduce transformer size via lower leakage inductance
Transformer delivers 3000 VDC isolation for Single-Pair Ethernet
The ZE2531 Isolation Transformer from Coilcraft is designed to provide galvanic isolation for Single Pair Ethernet (SPE) networks, supporting 10Base-T1L and Power over Data Line (PoDL) for … [Read More...] about Transformer delivers 3000 VDC isolation for Single-Pair Ethernet
How do thermal interface materials help in power electronics cooling?
Thermal interface materials (TIMs) are placed between two mating surfaces, such as a power semiconductor module and a heat sink, to improve heat flow between them. This FAQ will take a few examples to … [Read More...] about How do thermal interface materials help in power electronics cooling?
Power switch control and protection platform debuts with direct digital control
Amber Semiconductor, Inc. is showcasing its latest breakthroughs at APEC 2025, including its first commercial semiconductor line for AC to DC power conversion. This new offline AC-DC conversion … [Read More...] about Power switch control and protection platform debuts with direct digital control
Module features 96 – 98% efficiency in compact package
TDK Corporation announces the introduction of the TDK-Lambda brand DUSH series in a compact DIN rail mount package. The DUSH series provides backup power in the event of a power loss. It builds the … [Read More...] about Module features 96 – 98% efficiency in compact package
Two-stage buck regulator supports 0.35. V – 0.85 V output range
pSemi announced a breakthrough in multi-level buck regulator technology that promises to revolutionize the mobile battery charging industry. The multi-level technology is capable of high efficiency … [Read More...] about Two-stage buck regulator supports 0.35. V – 0.85 V output range
Hot swap controller withstands 100 V transients for 500 milliseconds
Infineon Technologies AG expands its XDP digital protection product family with the XDP711-001, a 48 V wide input voltage range digital hot swap controller with a programmable safe operating area … [Read More...] about Hot swap controller withstands 100 V transients for 500 milliseconds
High-speed isolated gate drivers optimized for bi-direction GaN control
Navitas Semiconductor has announced the latest breakthrough of the world’s first production-released 650 V bi-directional GaNFast ICs and high-speed isolated gate drivers, creating a paradigm shift in … [Read More...] about High-speed isolated gate drivers optimized for bi-direction GaN control
LED driver supports in-mold assembly for space-critical applications
Melexis unveiled the MLX80142 two RGB LED driver (six channels), the latest addition to its smart state machine LED driver portfolio and the first to incorporate MeLiBu 2.0. Leveraging Melexis' proven … [Read More...] about LED driver supports in-mold assembly for space-critical applications
Power components enhance efficiency in renewable energy systems
Magnachip Semiconductor Corporation announced the launch of two new 6th-generation (Gen6) 650V Insulated Gate Bipolar Transistors (IGBTs), specifically designed for solar inverters. The newly … [Read More...] about Power components enhance efficiency in renewable energy systems
Common-mode choke coils support LVDS and SerDes applications
The DLM11CN_HH2 Series Chip Common Mode Choke Coils from Murata have been developed to address the requirements of high-speed differential interfaces. These components, measuring 0504 inches, are … [Read More...] about Common-mode choke coils support LVDS and SerDes applications
Tiny, quad-phase power modules for vertical power delivery
Infineon Technologies AG launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance computing. Through enhanced system performance and … [Read More...] about Tiny, quad-phase power modules for vertical power delivery
Are SiC and GaN going to be replaced by ultra power semis?
With the recent announcement by Infineon that gallium nitride (GaN) use is reaching the “tipping point” for accelerated adoption, maybe it’s time to consider what’s next beyond wide bandgap (WBG) GaN … [Read More...] about Are SiC and GaN going to be replaced by ultra power semis?
500 V SMT transformers shrink in size
TDK has announced the EPCOS EP9 series of surface-mount transformers (ordering code B82804E). At 13 × 11 × 11 mm, these parts are smaller than the company's existing E10EM series of SMT transformers … [Read More...] about 500 V SMT transformers shrink in size
