Flip-chip technology is an advanced semiconductor packaging and assembly method that involves directly mounting the semiconductor chip onto a … [Read More...] about What is flip-chip technology in IC packaging?
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What are the foundations of Maxwell’s equations and how do they relate to TENGs?
Gauss's law for electricity, Gauss's law for magnetism, Faraday's law of induction, and Ampère's circuital law are the foundations of Maxwell’s … [Read More...] about What are the foundations of Maxwell’s equations and how do they relate to TENGs?
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Gate drive transformers provide galvanic isolation for IGBT and MOSFET control
ITG Electronics has introduced a new series of gate drive transformers comprising a range of products for various needs. The company’s T201213 Series of Gate Drive Transformers spans lower-current … [Read More...] about Gate drive transformers provide galvanic isolation for IGBT and MOSFET control
4 mm x 5 mm gate drivers feature 2.4A sink capability for GaN applications
STMicroelectronics’ new high-voltage half-bridge gate drivers for GaN applications add extra flexibility and features for greater efficiency and robustness. The latest STDRIVEG610 and STDRIVEG611 … [Read More...] about 4 mm x 5 mm gate drivers feature 2.4A sink capability for GaN applications
Voltage detector features -30 V to 45 V input range for automotive system
ABLIC launched the S-19116 Series, a new automotive high-voltage detector with a detection response time of max. 6.8μs while achieving current consumption of 2.0μA typ. Standard voltage monitoring … [Read More...] about Voltage detector features -30 V to 45 V input range for automotive system
Meeting demand for hidden wearables via Schottky rectifiers
Consumers demand increasingly powerful yet compact electronic devices in today's fast-paced world. From smartphones and laptops to wearable technology, these devices must deliver high performance … [Read More...] about Meeting demand for hidden wearables via Schottky rectifiers
Power resistor dissipates up to 35 W
Vishay Intertechnology, Inc. announced that it has extended its D2TO35 series of surface-mount thick film power resistors with a new AEC-Q200 qualified device that delivers higher pulse absorption up … [Read More...] about Power resistor dissipates up to 35 W
What is flip-chip technology in IC packaging?
Flip-chip technology is an advanced semiconductor packaging and assembly method that involves directly mounting the semiconductor chip onto a substrate or PCB with the circuitry facing downward. This … [Read More...] about What is flip-chip technology in IC packaging?
Eight-phase controller provides two output power rails
Alpha and Omega Semiconductor Limited announced its AOZ98252QI 2-output, 8-phase controller with low 2.5 mA quiescent power. Featuring AMD SVI3 high-speed and SMBus digital interfaces, the AOZ98252QI … [Read More...] about Eight-phase controller provides two output power rails
GaN switch delivers bidirectional voltage blocking in single device
Infineon Technologies AG is introducing the CoolGaN bidirectional switch (BDS) 650 V G5, a gallium nitride (GaN) switch capable of actively blocking voltage and current in both directions. Featuring a … [Read More...] about GaN switch delivers bidirectional voltage blocking in single device
Surface-mount Zener diodes debut with wide voltage range and small footprint
MCC has introduced the SMAF Series Zener diodes, a comprehensive product family offering 6.2 V to 100 V options with overvoltage protection capabilities. These 1 W Zener diodes come in the compact … [Read More...] about Surface-mount Zener diodes debut with wide voltage range and small footprint
Thyristors deliver 2 kA surge protection in compact DO-214AB package
Littelfuse, Inc. has launched the Pxxx0S3G-A SIDACtor Protection Thyristor Series, featuring 2 kA surge protection in a compact DO-214AB (SMC) package. The new devices enable product miniaturization … [Read More...] about Thyristors deliver 2 kA surge protection in compact DO-214AB package
Gate driver supports high-side switching up to a 200 V bootstrap operation
Littelfuse, Inc. has released the IXD2012NTR, a high-speed gate driver designed to drive two N-channel MOSFETs or IGBTs in a half-bridge configuration. The device operates over a 10 V to 20 V voltage … [Read More...] about Gate driver supports high-side switching up to a 200 V bootstrap operation
AEC-Q100 compliant isolators offer enhanced EOS resilience for battery management systems
NOVOSENSE Microelectronics has introduced a new line of third-generation digital isolators for automotive applications. The NSI83xx series uses capacitive isolation technology and is engineered for … [Read More...] about AEC-Q100 compliant isolators offer enhanced EOS resilience for battery management systems
Redundant power supplies deliver 59% increase in power density at 51 W/inch³
Delta has introduced a 5,500-W redundant power supply unit designed for AI data centers. It supports both 19-inch (1RU) and ORv3 21-inch (1OU) rack configurations. This unit recently received the new … [Read More...] about Redundant power supplies deliver 59% increase in power density at 51 W/inch³
D2PAK-7 surface mount SiC devices receive AEC-Q101 certification
A new series of 1200 V silicon carbide (SiC) MOSFETs has been released in a surface-mount D2PAK-7 package, now certified to AEC-Q101 for automotive applications. These components are available with … [Read More...] about D2PAK-7 surface mount SiC devices receive AEC-Q101 certification
Reference designs support 800 V automotive applications with 17 00V SiC switching
A series of new reference designs featuring a 1700 V-rated silicon carbide (SiC) integrated flyback switcher IC for use in electric vehicles operating at 800 V has been developed. These designs … [Read More...] about Reference designs support 800 V automotive applications with 17 00V SiC switching
