by Anup Bhalla, VP Engineering, UnitedSiC Wide bandgap semiconductors are enablers for highly efficient power conversion. There is a choice of devices to use, including SiC FETs, a hybrid of silicon and SiC technology. This article discusses characteristics of the devices in comparison with other approaches. High efficiency is the universal aim in the world […]
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Basics of motion-control profiles, Part 3: Implementations
How a motor ramps its angular position or rotational velocity from a starting point to the intended target value is a complicated topic which modern motor controllers address in many ways. Part 2 of this article looked at the basic ramping trajectories of the motion-control system. This final part briefly explores some standard motion-control ICs […]
Basics of motion-control profiles, Part 2: Ramp profiles
How a motor ramps its angular position or rotational velocity from a starting point to the intended target value is a complicated topic which modern motor controllers address in many ways. Part 1 was an introduction to issues related to motor and motion control. This part will focus on the topic of motor ramping and […]
Basics of motion-control profiles, Part 1: Context
How a motor ramps its angular position or rotational velocity from a starting point to the intended target value is a complicated topic which modern motor controllers address in many ways. Controlling the motion of a motor is a major design challenge since how a well a possible motor choice can ramp its speed and […]
Haptics Components, Pt 1: LRA, ERM, and piezo actuators
Haptics capabilities are embedded in smartphones and game controllers, and their use is expanding into robotic controls, automobile consoles, and more; the physical actuator and its driver are the key hardware elements. Haptics-enhanced devices are all around us, even if we don’t consciously realize it. The smartphone with different vibrations depending on who is calling […]
Overcoming stepper motor design challenges in 3D printers
By Dipankar Mitra, System Engineer, Texas Instruments 3D printing is a fast-emerging market with significant growth potential. 3D printers create three-dimensional objects, with complex shapes and geometries, through the successive deposition of materials directly from a computer-aided design model. The agriculture, health care, automotive, locomotive, and aviation industries are some of the first adopters of […]
Thunderbolt 3, 4, 5 and USB
With Thunderbolt 3 well established, Thunderbolt 4 coming onto the market, and Thunderbolt 5 in the early stages of being defined, it’s important that designers understand the similarities and differences between the various flavors of Thunderbolt and how they compare and contrast with USB. Intel designed thunderbolt technology in cooperation with Apple to support new […]
Testing considerations for USB and USB-PD
Designers integrating USB Type C and USB4 into their products confront several challenges to ensure interoperability and compliance. Compared with previous generations, the latest USB specifications are more demanding due to higher power and more complex power profiles, higher data transmission speeds, and more functionality in general. To address these challenges, test engineers must start […]
USB proliferation of capabilities and compatibilities
USB4 represents a significant change from past standards from the USB Implementers Forum (USB-IF). USB4 is based on the Thunderbolt 3 protocol. Support of Thunderbolt 3 interoperability is required on all ports for USB4 docks. It is required for downward-facing ports on hubs and is optional for USB4 hosts and peripheral devices. Like Thunderbolt, USB4 […]
Power distribution network integrity in embedded systems – Part 2
Welcome to this Virtual Interview on power distribution network (PDN) integrity in embedded systems. We are here today with Heidi Barnes (HB), Senior Application Engineer for PathWave EDA for High Speed Digital with Keysight Technologies. The following is from an interview with Heidi by EEWorld’s Jeff Shepard where they discuss the use of decoupling capacitors […]
