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AI

MOSFET powers 48 V hot swap in AI servers

December 3, 2025 By Redding Traiger Leave a Comment

Alpha and Omega Semiconductor Limited announced its AOLV66935, a 100V High Safe Operating Area (SOA) MOSFET in an LFPAK 8×8 package. AOS’s latest MOSFET is designed as an ideal solution for 48V Hot Swap architectures in AI servers. The power demands of AI servers are intensifying, primarily driven by the increasing performance of the GPU/TPU. […]

Filed Under: AI, Applications, Development Tools, MOSFETS, Power Components Tagged With: alphaandomegasemiconductorlimited

Dual-voltage Flash offers faster program and erase performance

November 26, 2025 By Redding Traiger Leave a Comment

GigaDevice has introduced the GD25NX family of dual-voltage xSPI NOR Flash devices, designed with a 1.8 V core and 1.2 V I/O interface. The series connects directly to 1.2 V system-on-chip designs without requiring an external booster, reducing overall power consumption and component count. The GD25NX line builds on earlier 1.2 V I/O products and […]

Filed Under: AI, Applications, Automotive, Data center, Development Tools, Power Components, Power Management, Switches, wearables, Wearables Tagged With: gigadevice

TOLL-package MOSFETs support compact, high-power electronics

November 3, 2025 By Redding Traiger Leave a Comment

Magnachip Semiconductor Corporation has released two 650V Super Junction MOSFETs in a TO-Leadless (TOLL) package configuration. The devices are designed for high-power and high-current applications, including consumer electronics such as televisions, gaming monitors, and power adaptors. The new MOSFETs use a 4-pin Kelvin source configuration, which helps minimize parasitic inductance in the gate-source return path. […]

Filed Under: AI, Consumer electronics, Data center, Development Tools, MOSFETS, Power Components, Power Management Tagged With: magnachipsemiconductor

GaN-on-GaN design supports compact, efficient power conversion

October 31, 2025 By Redding Traiger Leave a Comment

Onsemi conductor has introduced a new generation of vertical gallium nitride (vGaN) devices featuring GaN-on-GaN architecture and designed to enhance power density, efficiency, and reliability in high-performance applications. Unlike lateral GaN structures built on silicon or sapphire substrates, the vertical configuration conducts current through the semiconductor material itself, enabling operation at higher voltages and switching […]

Filed Under: Aerospace, AI, Automotive, Data center, Development Tools, Industrial, Power Components, Power Management, Switches Tagged With: onsemiconductor

Modular GaN reference design scales to 108 kW configurations

October 22, 2025 By Redding Traiger Leave a Comment

Efficient Power Conversion Corporation has released a 5 kW AC-to-48 V DC reference design using enhancement-mode gallium nitride power devices. The system achieves 96.5% efficiency and 116 W/in³ power density while meeting Open Rack V3 size specifications. The design consists of two stages. The EPC91107KIT front-end stage converts 240 VAC to 400 VDC using a […]

Filed Under: AI, Data center, Development Tools, Power Components, Reference design Tagged With: efficientpowerconversioncorporation, GaN

Reference board delivers 12-kilowatt thermal design power with SiC JFET

October 15, 2025 By Redding Traiger Leave a Comment

Infineon Technologies AG has launched a 48-volt smart eFuse family and a reference board for hot-swap controllers designed for 400-volt and 800-volt power architectures in AI data centers. The products address power path protection requirements for high-power AI server systems operating at voltages from 48V to 400V and 800V. The eFuse ICs XDP730, XDP720, XDP721, […]

Filed Under: AI, Data center, Development Tools, Fuses, Power Components, Reference design Tagged With: infineontechnolgiesag

GaN-based device addresses megawatt-scale rack power delivery requirements

October 14, 2025 By Redding Traiger Leave a Comment

EPC introduced a gallium nitride-based power converter designed for 800 VDC distribution systems in AI data centers. The 6 kW converter transforms 800 V to 12.5 V using an Input Series Output Parallel topology. AI data centers require megawatt-scale rack power delivery systems. The GaN-based converter occupies under 5,000 square millimeters with a height of […]

Filed Under: AI, Converters, Data center, Development Tools, Power Components, Power Management Tagged With: epc

What is new in UCIe 3.0?

October 8, 2025 By Jeff Shepard Leave a Comment

Universal Chiplet Interconnect Express (UCIe) 3.0 is focused on increased bandwidth, improved power efficiency, and enhanced system-level management for next-generation chiplet-based designs. It’s designed to support artificial intelligence and high-performance computing while maintaining backward compatibility with UCIe 2.0 and 1.0. UCIe 3.0 continues to support 3D packaging. It doubles the bandwidth of UCIe 2.0 and […]

Filed Under: AI, FAQ, Featured

Coolers stabilize laser temperature in 800 G to 3.2 T optical modules

October 6, 2025 By Redding Traiger Leave a Comment

Tark Thermal Solutions has introduced custom configurations in its OptoTEC MBX thermoelectric cooler series for optical transceivers operating at 800 gigabits per second, 1.6 terabits per second, and 3.2 terabits per second. The modules are designed for OSFP and QSFP-DD transceiver formats used in AI data centers and telecommunications infrastructure. The MBX series provides active […]

Filed Under: AI, Data center, Development Tools, Telecommunications Tagged With: tarkthermalsolutions

Dual-phase module delivers 140 A in 9 x 10 x 5 mm package

October 6, 2025 By Redding Traiger Leave a Comment

Infineon Technologies AG is launching the OptiMOS TDM22545T dual-phase power module, the industry’s first trans-inductance voltage regulator (TLVR) module specifically designed for high-performance AI data centers. The module’s proprietary TLVR inductance architecture minimizes the number of output capacitors, reducing the overall size of the voltage regulator (VR) and significantly lowering material costs (bill of materials; […]

Filed Under: AI, Data center, Development Tools, Power Components, Power Management, power modules Tagged With: infineontechnolgiesag

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Protecting Ethernet interfaces in telecommunications applications against common high energy surges

Ionic cooling: a silent revolution in thermal management

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The case for vehicle 48 V power systems

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