• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer
  • Subscribe
  • Advertise

Power Electronic Tips

Power Electronic News, Editorial, Video and Resources

  • Products
    • Power Supplies
    • AC-DC
    • DC-DC
    • Battery Management
    • Capacitors
    • Magnetics
    • MOSFETS
    • Power Management
    • RF Power
    • Resistors
    • Transformers
    • Transistors
  • Applications
    • 5G
    • AI
    • Automotive
    • EV Engineering
    • LED Lighting
    • Industrial
    • IoT
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • EE Training Days
    • FAQ
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • White Papers
  • Video
    • EE Videos & Interviews
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineeering Training Days
  • Newsetter Subscription

ANADIGICS Launches Smallest CDMA Power Amplifier for Next-Gen Mobile Handsets

June 16, 2010 By admin Leave a Comment

WARREN, NJ – ANADIGICS, Inc. (Nasdaq: ANAD) announced the latest version of its highly successful dual-band CDMA power amplifiers (PAs) – the AWC6323 – designed for today’s most advanced CDMA handsets and data cards for the world’s leading wireless providers. For the first time, high performance directional couplers have been integrated into a dual band CDMA PA in the 3 X 5 X 1 (mm) footprint. The product also offers the lowest quiescent current for a CDMA PA in the industry which helps extends the battery life. The innovations built into the AWC6323 enable the latest generation handsets to provide an improved consumer experience.

ANADIGICS-AWC6323

The AWC6323 is the flagship PA in ANADIGICS’ portfolio of High-Efficiency-at-Low-Power (HELPÔ) family of CDMA PAs. The device is now ramping into volume production and complete evaluation kits are available upon request.

Key facts and highlights:

* The AWC6323 Offers 3 mode states to achieve high power added efficiencies at several power levels during the phone operation.

* It also helps reduce the idle current of the power amplifier to industry-best 3.5mA for a CDMA power amplifier. This directly helps in increasing the talk time performance of the handset without the need for a DC-DC converter.

* The AWC6323 PA features a common output port for the directional couplers built inside the package. These couplers offer 20dB directivity and 22dB coupling factor. This feature helps eliminate the surface mount couplers placed on the phone board

* The device also meets the stringent linearity requirements of CDMA EV-DO Revisions A and B modulations, to offer very high data rates for smart phones and data cards.

* The AWC6323 is manufactured on advanced indium gallium phosphide (InGaP) BiFET™ MMIC technology, offering the highest levels of reliability, temperature stability and ruggedness.

The AWC6323 will be on display at Mobile World Congress, Feb. 15-18 in Barcelona, Spain. For more information, visit the ANADIGICS booth located at Stand 2C19 in Hall 2 or visit www.anadigics.com.

ANADIGICS, Inc.
www.anadigics.com

::Design World::

Filed Under: DC-DC, Power Components, Power Management

Reader Interactions

Leave a Reply

You must be logged in to post a comment.

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Primary Sidebar

Featured Contributions

Protecting Ethernet interfaces in telecommunications applications against common high energy surges

Ionic cooling: a silent revolution in thermal management

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

The case for vehicle 48 V power systems

More Featured Contributions

EE LEARNING CENTER

EE Learning Center

EE TECH TOOLBOX

“ee
Tech Toolbox: Connectivity
AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

EE ENGINEERING TRAINING DAYS

engineering
“power
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.
“bills

RSS Current EDABoard.com discussions

RSS Current Electro-Tech-Online.com Discussions

  • wall transformer polarity
  • Supply vs performance query
  • Do i need a buffer?
  • BPF
  • Figgie International intercom 1998 era

Footer

EE World Online Network

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Microcontroller Tips
  • Sensor Tips
  • Test and Measurement Tips

Power Electronic Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy