The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2020 in New Orleans, La. titled, “Packaging Power Circuits to Make Small and Reliable Products.” Featuring speakers from leading industry and research organizations, the session (IS15) will present an up-to-date look at current and future packaging and manufacturing technologies utilizing high-density 3D packaging. The session will take place on Wednesday afternoon, March 18th, 2020, from 2:30 – 5:35 p.m. in Room R1 of the New Orleans Convention Center.
Manufacturers utilizing power sources in their products are continually asking for smaller solutions. The industry can deliver with new components, design and manufacturing techniques that support higher density, higher reliability, and higher frequency operation. A 3D packaging approach using embedded components (actives and passives) combined with advanced manufacturing technologies is proving to be the most reliable solution, offering the fastest time to market for achieving increased power density in a smaller footprint. This solution is already in production in semiconductor, component and power supply designs.
The 3D Power Packaging Industry Session will feature seven invited experts, offering application details, real-world examples of implementation and a comprehensive analysis of the reliability challenges of high power in small packages. Attendees will get a realistic understanding of the challenges in diverse applications such as 5G base stations and automotive motor drives.
Co-chairs of the session, Ernie Parker of Crane of Aerospace & Electronics and Brian Narveson of Narveson Consulting, encourage industry professionals to attend the Industry Session on 3D Power Packaging. Parker stated, “This session will provide a valuable opportunity to meet other professionals who are active in the evolving design, reliability and manufacturing of 3D in higher power applications.” Narveson added, “The 3D Power Packaging Industry Sessions at APEC continues to be the place to go for leading-edge packaging solutions.”
All APEC attendees are invited to attend the PSMA Packaging Committee meeting scheduled for Tuesday, March 17th, 2020 from 10:00 am to 12:00 noon in the New Orleans Convention Center Room 231. Participants are also encouraged to participate in the other PSMA-sponsored meetings being held throughout the week.