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Featured

What is the IEEE 1801-2024 Unified Power Format 4.0 standard?

June 18, 2025 By Jeff Shepard

IEEE Unified Power Format (UPF) 4.0 is a standard specification language that defines the low-power architecture of low-power ASICs. It’s designed to streamline integration throughout the design, verification, and implementation process, with a focus on power intent for energy-aware electronic system design. UPF is built using the Tool Command Language (TCL) and complements hardware description […]

Filed Under: FAQ, Featured Tagged With: FAQ

Gate drivers — the critical link in power-device performance: part 3

June 11, 2025 By Bill Schweber

This section will discuss some of the many subtleties of the gate driver and its power source. Other gate-driver converter considerations Gate-driver dc-dc converters have other unique issues. Among them are: 1) Regulation: the load on the dc-dc converter is close to zero when the device is not switching. However, most conventional converters require a […]

Filed Under: drivers, FAQ, Featured Tagged With: FAQ

Gate drivers — the critical link in power-device performance: part 2

June 4, 2025 By Bill Schweber

Thus far, we have examined the general issue of power devices and their characteristics. This part goes into the details of the power-device gate driver. Gate-drive details To drive current into the gate, the positive rail’s voltage should be high enough to ensure full saturation/enhancement of the power switch, but without exceeding the absolute maximum […]

Filed Under: drivers, FAQ, Featured Tagged With: FAQ

Robust design for Variable Frequency Drives and starters

May 29, 2025 By Christophe Warin, Systems Engineering Manager, Semiconductor Business Unit, Littelfuse, Inc.

Variable Frequency Drives (VFDs) and soft starters are essential components in modern industrial and commercial systems. VFDs provide precise control over motor speed, torque, and efficiency, matching speed to load requirements to minimize energy consumption. Soft starters gradually increase motor voltage to limit inrush current and prevent damage to the electrical system. Controlled inrush current […]

Filed Under: FAQ, Featured, Featured Contributions Tagged With: FAQ

Gate drivers — the critical link in power-device performance: part 1

May 28, 2025 By Bill Schweber

Effective MOSFET/IGBT-device switching depends on the gate driver and its power supply. From power supplies and motor drives to charging stations and myriad other applications, switching power semiconductors such as silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) MOSFETs, as well as insulated-gate bipolar transistors (IGBTs), are the key to efficient power-system designs. However, […]

Filed Under: DC-DC, FAQ, Featured Tagged With: FAQ

Why is understanding safe operating area (SOA) necessary for power electronics engineers?

May 21, 2025 By Rakesh Kumar

Power semiconductor devices and batteries operate within specific safe operating areas (SOAs) to ensure reliability and longevity. This FAQ explains the progression from basic operating areas to electrical and thermal SOAs, culminating in the combined SOA. We will examine how these concepts apply to both semiconductor devices and batteries, with a practical case study of […]

Filed Under: FAQ, Featured Tagged With: FAQ

Meeting demand for hidden wearables via Schottky rectifiers

May 15, 2025 By By Shane Timmons, Product Marketing Manager, Discrete Business Group, Diodes Incorporated

Consumers demand increasingly powerful yet compact electronic devices in today’s fast-paced world. From smartphones and laptops to wearable technology, these devices must deliver high performance while fitting into our increasingly mobile lifestyles. Engineers constantly seek innovative solutions to meet these demands and enhance device efficiency, battery life, and overall user experience. Advancements in battery technology […]

Filed Under: diodes, Featured, Featured Contributions, Power Components Tagged With: Diodes Inc, FAQ

What is flip-chip technology in IC packaging?

May 14, 2025 By Rakesh Kumar

Flip-chip technology is an advanced semiconductor packaging and assembly method that involves directly mounting the semiconductor chip onto a substrate or PCB with the circuitry facing downward. This FAQ will convey the basic idea of flip-chip technology and how it differs from conventional wire bonding technology. A simple view of the flip-chip technology A simplistic […]

Filed Under: FAQ, Featured Tagged With: FAQ

What are the foundations of Maxwell’s equations and how do they relate to TENGs?

May 7, 2025 By Jeff Shepard

Gauss’s law for electricity, Gauss’s law for magnetism, Faraday’s law of induction, and Ampère’s circuital law are the foundations of Maxwell’s equations. But Maxwell saw what wasn’t there. He added a term to one of the equations, providing a single mathematical model for electric, optical, and radio technologies and changing scientists’ understanding of the world. […]

Filed Under: FAQ, Featured Tagged With: FAQ

The case for vehicle 48 V power systems

May 2, 2025 By Kirk Ulery, Molex

Moving from 12 to 48 V systems will reduce vehicle weight through thinner, lighter cables. Tradeoffs include more stringent safety requirements. As vehicles integrate advanced features such as advanced driver-assistance systems (ADAS), vehicle-to-everything (V2X) communications, and electric turbocharging, the limitations of traditional 12 V systems become increasingly evident. To meet these and other power-hungry applications, […]

Filed Under: FAQ, Featured, Featured Contributions Tagged With: FAQ, molex

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Featured Contributions

Robust design for Variable Frequency Drives and starters

Meeting demand for hidden wearables via Schottky rectifiers

The case for vehicle 48 V power systems

GaN reliability milestones break through the silicon ceiling

Developing power architecture to support autonomous transportation

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