Zoned Cooling™ reference design from Ventiva introduces a zone-based thermal architecture that directs airflow to high-heat components such as CPUs, GPUs and AI accelerators rather than cooling an entire chassis uniformly. The design replaces mechanical fans with solid-state ionic cooling modules, enabling reclaimed motherboard space, reduced noise and modular scalability across AI-ready laptops, client-edge devices […]
Thermal management
NTC inrush limiters for high-power supplies
TDK Corporation introduces the new S series inrush current limiters (ICLs), comprising the S30 (ordering code: B57130S0*M000) and S36 (B57136S0*M100) families of NTC thermistors. With maximum steady-state currents of up to 35 A and energy absorption capabilities of up to 750 J, the components are optimized for high-power applications that demand reliable suppression of inrush […]
How and where is vapor chamber cooling used?
A vapor chamber, sometimes called a planar heat pipe or heat spreader, is a phase-change thermal management tool used in high-performance electronic devices and systems with high heat-flux components, where even heat distribution is needed. It is especially applicable where space is limited or conventional cooling is insufficient. It can be viewed as a four-step […]
Ionic cooling: a silent revolution in thermal management
As consumer electronics push the boundaries of thinness and performance, traditional cooling options are straining under ever-higher thermal loads. Mechanical fans have carried the burden for decades, but they impose limits on device height, acoustic performance, reliability, and board layout. Ionic cooling offers a fundamentally different approach: solid-state airflow driven by electrohydrodynamic (EHD) forces that […]
An overview of Computational Fluid Dynamics (CFD)
Understanding airflow, heat transfer, and fluid behavior is critical when designing high-performance electronic systems. That’s where Computational Fluid Dynamics (CFD) comes in. CFD uses advanced numerical analysis to simulate how fluids — like air or coolant — move through and around complex geometries. For engineers working on thermal management, enclosure design, or aerodynamic optimization, CFD […]
Silicon-based MEMS fan addresses thermal bottlenecks in 800G and 1.6T optical interconnects
xMEMS Labs, Inc. has announced the extension of its µCooling fan-on-a-chip technology into AI data centers, providing an in-module active thermal management solution for optical transceivers. Originally designed for compact mobile devices, the µCooling platform now addresses the thermal challenges faced by dense, thermally-constrained environments in high-speed optical transceivers, including those operating at 400G, 800G, […]
1.25″ to 2″ diameter cooling hose for data center thermal management
Gates has released the Data Master MegaFlex, a large-diameter cooling hose designed for data center applications. This product expands Gates’ data center cooling portfolio beyond the small-diameter Data Master hose introduced in 2024. The Data Master MegaFlex is engineered for high-flow supply in liquid cooling systems, specifically handling thermal loads in high-density server environments. It […]
How do thermal interface materials help in power electronics cooling?
Thermal interface materials (TIMs) are placed between two mating surfaces, such as a power semiconductor module and a heat sink, to improve heat flow between them. This FAQ will take a few examples to illustrate how TIMs conduct thermal management in power electronics. Where are TIMs finding their place in power electronics cooling? Power electronics […]
ORv3-compatible racks with integrated liquid cooling for AI workloads
Flex has introduced a range of new products and partnerships aimed at addressing the growing demands of AI and high-performance computing (HPC) applications. The company announced customizable compute reference designs incorporating JetCool’s SmartPlate direct-to-chip liquid cooling solution, capable of cooling over 1,500W per socket. In collaboration with JetCool, Flex is set to deliver liquid-cooled solutions […]
What are the derating and other design considerations when using bimetallic thermal control devices?
Several design factors relate to specifying and using bimetallic thermal control devices and how they are used in systems. The metals and structure of the bimetallic element are of first importance. The selection of those metals impacts the device’s sensitivity and other performance parameters. Derating is especially important for conductive-type devices. The coefficients of linear […]
