Understanding airflow, heat transfer, and fluid behavior is critical when designing high-performance electronic systems. That’s where Computational Fluid Dynamics (CFD) comes in. CFD uses advanced numerical analysis to simulate how fluids — like air or coolant — move through and around complex geometries. For engineers working on thermal management, enclosure design, or aerodynamic optimization, CFD […]
Thermal management
Silicon-based MEMS fan addresses thermal bottlenecks in 800G and 1.6T optical interconnects
xMEMS Labs, Inc. has announced the extension of its µCooling fan-on-a-chip technology into AI data centers, providing an in-module active thermal management solution for optical transceivers. Originally designed for compact mobile devices, the µCooling platform now addresses the thermal challenges faced by dense, thermally-constrained environments in high-speed optical transceivers, including those operating at 400G, 800G, […]
1.25″ to 2″ diameter cooling hose for data center thermal management
Gates has released the Data Master MegaFlex, a large-diameter cooling hose designed for data center applications. This product expands Gates’ data center cooling portfolio beyond the small-diameter Data Master hose introduced in 2024. The Data Master MegaFlex is engineered for high-flow supply in liquid cooling systems, specifically handling thermal loads in high-density server environments. It […]
How do thermal interface materials help in power electronics cooling?
Thermal interface materials (TIMs) are placed between two mating surfaces, such as a power semiconductor module and a heat sink, to improve heat flow between them. This FAQ will take a few examples to illustrate how TIMs conduct thermal management in power electronics. Where are TIMs finding their place in power electronics cooling? Power electronics […]
ORv3-compatible racks with integrated liquid cooling for AI workloads
Flex has introduced a range of new products and partnerships aimed at addressing the growing demands of AI and high-performance computing (HPC) applications. The company announced customizable compute reference designs incorporating JetCool’s SmartPlate direct-to-chip liquid cooling solution, capable of cooling over 1,500W per socket. In collaboration with JetCool, Flex is set to deliver liquid-cooled solutions […]
What are the derating and other design considerations when using bimetallic thermal control devices?
Several design factors relate to specifying and using bimetallic thermal control devices and how they are used in systems. The metals and structure of the bimetallic element are of first importance. The selection of those metals impacts the device’s sensitivity and other performance parameters. Derating is especially important for conductive-type devices. The coefficients of linear […]
What’s the difference between cantilever and disk bimetallic thermal control devices?
The physical structure of the bimetallic element that provides thermal control is the difference between cantilever and disk bimetallic thermal control devices. This article begins by reviewing how bimetallic structures are made and operated. It then looks at how they are implemented in cantilever and disk thermal control devices. Two dissimilar metals are joined together […]
How soft switching and SiC devices improve power conversion
By Mike Zhu, Qorvo Soft switching in DC-DC converters reduces energy loss. SiC transistors allow for higher switching frequencies and, thus, smaller magnetics, which reduces heat. Efficiency and power density are both essential factors in the design of power converters. Every contributor to energy loss generates heat that needs removal by costly and power-hungry cooling […]
Power GaN devices minimize cooling needs
Cambridge GaN Devices (CGD) has announced two new packages for the company’s ICeGaN family of GaN power ICs that offer enhanced thermal performance and simplify inspection. Variants of the well-proven DFN style, both packages are extremely rugged and reliable. Developed for CGD, the DHDFN-9-1 (Dual Heat-spreader DFN) is a thin, dual-side cooled package with a […]
Environmentally friendly thermoelectric cooler assemblies targets medical diagnostics and analytical instruments
Laird Thermal Systems has launched a new high-performance thermoelectric cooler assembly series that utilizes next-generation thermoelectric coolers with advanced semiconductor materials. This enhancement boosts cooling performance by up to 10% over previous models. In combination with a high-performance heat sink and fan shroud assembly, the ultra-compact SuperCool X Series can transfer heat to ambient environments […]
