Heat-transfer compound boasts low thermal resistance

SARCON SPG-70A is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among dispensable SPG products. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.2 mm. This allows for more efficient transfer and dissipation of heat from the component and improved performance.

SARCON SPG-70A has excellent vibration absorption capabilities and requires no heat curing. Customers can order this product in 30-cc syringes or 325-cc cartridges. Custom packaging is also available upon request.

Fujipoly America Corp., 900 Milik St, Carteret, NJ 07008, (732) 969-0100, www.fujipoly.com/usa