SARCON PG130A from Fujipoly is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely low material compression. This low modulus thermal gap filler also helps reduce stress on the PCB during […]
fujipolyamerica
Heat-transfer compound boasts low thermal resistance
SARCON SPG-70A is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among dispensable SPG products. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.2 mm. […]
Dispensable thermal gap filler provides 2 to 7 W/m-K thermal conductivity
New 2 to 7 W/m-K dispensable thermal interface gap fillers are dispensable are dispensable thermal interface materials suitable for many types of applications, including thin bond line and gap filler applications. Both silicone and non-silicone options are available as well as one-part and two-part options. Various types of dispensing systems range from low-cost approaches for […]
Non-silicone grease provides low thermal resistance
New 5 and 6W/m-K SARCON thermally conductive greases, SARCON SG-50NS and SG-60NS, offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as well as the non-silicone advantages of no creep or migration. SG-50NS and SG-60NS are high-performance, thermal greases designed to meet the thermal, reliability and […]
Form-in-place thermal gap filler contains no silicone
SARCON SPG-25B-NS from Fujipoly is an easy to dispense, low-viscosity, silicone-free compound that exhibits a thermal conductivity of 2.5 W/m°K and a thermal resistance of only 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills delicate gaps as small as 0.5 mm. This allows […]
Low oil-bleed/specific-gravity gap filler pad material in sheets, custom shapes
Sarcon GR14B from Fujipoly is a low oil-bleed/specific-gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is a candidate for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thick, highly conformable gap […]
Thermal interface materials sport low compression force at high compression rates
SARCON PG45A from Fujipoly is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus thermal gap […]
Putty-like thermal interface material delivers high conductivity
SARCON PG80B is high-performance putty-like thermal interface material. This extremely compressible gap filler delivers a thermal conductivity of 8.0 W/m°K with a thermal resistance as low as 0.05°C•in2/W at 43.5 PSI. SARCON PG80B requires a very low compression force, even under high compression rates, to make reliable contact between heat-generating components and nearby heatsinks. This […]
