Nexperia announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data lines in interfaces such as USB, HDMI, high-speed video links, and ethernet in automotive infotainment applications. These latest additions include PESD18VF1BLS-Q, PESD24VF1BLS-Q, PESD30VF1BLS-Q, and PESD32VF1BLS-Q in the DFN1006BD-2 package which enables optical inspection in automotive production lines using […]
Automotive
SMD-based, GaN TOLL FETs are drop-in replacements for any e-mode devices
Transphorm, Inc. today introduced three SuperGaN® FETs in TOLL packages with on-resistances of 35, 50, and 72 milliohms. Transphorm’s TOLL package configuration is industry standard, meaning the SuperGaN TOLL FETs can be used as drop-in replacements for any e-mode TOLL solution. The new devices also offer Transphorm’s proven high voltage dynamic (switching) on-resistance reliability that […]
Power MOSFET meets AEC-Q101 automotive stress test
Littelfuse, Inc. announced the release of IXTY2P50PA, the first automotive-grade PolarP P-Channel Power MOSFET. This innovative product design meets the demanding requirements of automotive applications, providing exceptional performance and reliability. The key differentiator of the –500 V, –2 A IXTY2P50PA is its AEC-Q101 qualification, making it ideal for automotive applications. This qualification ensures that the […]
2.7 V and 3 V radial supercapacitors address fast charting energy storage applications
Abracon announces the launch of an all-new line of 2.7V & 3.0V EDLC radial supercapacitors. These supercapacitors have the capacity to revolutionize energy supply and energy storage with their unmatched performance, reliability, and versatility. Abracon’s new line of supercapacitors, also known in the industry as ultracapacitors, have been designed and engineered to address the ever-growing […]
Current sense resistor offers higher power rating in tiny 1206 package
KOA Speer Electronics introduces a one-watt 1206-size automotive current sense resistor, the new UR73VH2B. The UR73VH2B offers a higher power rating in the smaller 1206 package size. It extends the resistance range for the UR73VHB by encompassing 100m to 1Ω, has a T.C.R. of ±100ppm/°C, and a standard tolerance of ±1%. It also has a […]
EMI suppression capacitors designed for harsh environments
New Yorker Electronics has announced its distribution of the new Cornell Dubilier Electronics (CDE) MXH series of X2, EMI/RFI suppression capacitors designed for harsh environments. The MXH series is AEC-Q200 qualified, meets a 2,000-hour THB (Temperature, Humidity, Bias) life test, and has applications in motors, AMR (Automated Meter Readers), UPS, power supplies, charging systems, and […]
FD and LIN buses enhance automotive power management IC
STMicroelectronics’ SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver[1], and an optional LIN transceiver[2]. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to help minimize power consumption. […]
Bidirectional power for EVs: the practical and creative opportunities using power modules
Given the coexistence of 400 V and 800 V EVs on the road, what options are there to harmonize these two distinct architectures? We all know the race is on for electrification, whether through government mandates and incentives or consumers demanding green transportation solutions with higher performance, longer range, and more features. Car makers are […]
500 mA dual RETs offer high-power load switching for space-constrained applications
Nexperia released a new series of 500 mA dual resistor-equipped transistors (RET) in ultra-compact DFN2020(D)-6 packaging. These devices have been designed for load switching in wearables and smartphones as well as for use in digital circuits with higher power requirements. Such as space-constrained computing, communications, industrial, and automotive applications. Notably, the RET in DFN configuration […]
Schottkys in DPACK footprint offer drop-in improvements in power density, thermal performance.
Taiwan Semiconductor announces its new ThinDPAK family of ultra-fast-recovery Schottky rectifiers. ThinDPAK devices have the same footprint as standard DPAKs – but come in a thinner (1.33mm) package and offer superior power density and thermal performance. Fully AEC-Q qualified with a maximum operating temperature (Tj, max) of 175°C and typical reverse-recovery time of 25ns, ThinDPAKs assure […]