Infineon Technologies AG announces the OptiMOS Linear FET series. This new product family combines the state-of-the-art on-state resistance (R DS(on)) of a trench MOSFET with the wide Safe Operating Area of a planar MOSFET. This solves the trade-off between R DS(on) and linear mode capability. The OptiMOS Linear FET can operate in the saturation region of an enhanced […]
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Passive cooling options and considerations (part 2)
Part 1 looked at the basics of passive cooling. Part 2 explores the specifics of passive cooling in more detail. Q: What is a most common physical arrangement used for passive cooling? Most designs use a combination of conduction and convection cooling, and perhaps some radiation. Conduction is used to draw the heat away from […]
IGBT modules rated at 150 A
Infineon Technologies AG is expanding the product portfolio of the IGBT modules with the EconoPIM™ 3 package. The current rating of the module is thereby increased from 100 A by 50 percent to 150 A. The new power modules serve the growing demand for higher power density within the same footprint. Typical applications are motor controls […]
Passive cooling options and considerations (Part 1)
Keeping components and systems cool enough and within their safe temperature zone is a concern for many, though not all, designers and projects. Excessive heat as measured by temperature can cause erratic behavior, inaccuracy and drift due to temperature coefficient-induced shifts, shortened component lifetime, and even outright failure. Q: What are the cooling options? The […]
High-side smart power switch ICs for automotive applications
Car makers want in-vehicle electronic systems to provide a large number of energy-efficient functions in as little space as possible. Infineon Technologies AG supports this trend with its new power IC manufacturing technology SMART7. Infineon designed it specifically for automotive applications such as Body Control Modules or Power Distribution Centers. SMART7 power ICs drive, diagnose and protect […]
1.2-kV IGBTs go to TO-247 packages for better heat dissipation
Infineon Technologies AG expands its 1200 V discrete IGBT product portfolio by offering up to 75 A. The devices are co-packed with a full rated diode in a TO-247PLUS package. The new TO-247PLUS 3pin and 4pin packages serve the growing demand for higher power density and highest efficiency in discrete packages. Typical applications with a […]
IGBTs come in fully isolated TO-247 package
Infineon Technologies AG introduces the new package technology TRENCHSTOP Advanced Isolation. It is available for TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs for best-in-class thermal performance and simpler manufacturing. The two versions are performance optimized to replace both fully insulated packages (FullPAKs) as well as standard and high-performance isolation foils. The new package targets applications like […]
40-V MOSFET targets battery powered tool, small EV apps
Infineon Technologies AG complements its StrongIRFET™ family with a 40 V MOSFET packaged in D²PAK 7pin+. The new MOSFET family offers an extremely low R DS(on) of 0.65 mΩ and the highest current carrying capability in the industry. This increases both robustness and reliability for high power density applications which require high efficiency and reliability. The surface […]
