Knowles Precision Devices recently announced the release of a new 100nF capacitor within its V-Series of single-layer capacitors. The 100nF is a high frequency, wire bondable single layer capacitor, making it ideally suited for GaN and GaAs amplifier applications where small size and microwave performance are critical. V-Series single-layer capacitors, including the new 100nF, are […]
Automotive
Powering EVs with silicon carbide
A flyback converter/isolated-gate-driver combo reduces the cost and complexity of implementing SiC FET designs in EV systems. Charlie Ice, Silicon Labs Electric vehicles are pushing the limits of today’s power conversion technology, and the advent of high-power silicon-carbide (SiC) FETs has pushed the envelope even further. The many advantages of SiC FETs allow for higher […]
Silicone-free gap filler features high thermal conductivity
Laird Performance Materials continues to focus on innovation with its release of its Tflex SF10 Series, a silicone-free gap filler delivering 10 W/mk thermal conductivity along with low deflection properties enabling it to exert minimal pressure on delicate components. Along with no silicone and its high thermal conductivity, a key differentiator of Laird’s Tflex SF10 […]
Half-bridge automotive MOSFETs offered space-saving LFPAK56D package
Nexperia announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters. The new package provides a half-bridge solution in one device, occupying 30% lower PCB […]
High-voltage bi-directional current-sense amplifiers boost power efficiency
STMicroelectronics has introduced three precision high-voltage bi-directional current-sense amplifiers that provide the extra convenience of a Shutdown pin to maximize energy savings. The TSC2010, TSC2011, and TSC2012 amplifiers also allow designers to minimize power dissipation by leveraging their precision characteristics to select low sense-resistor values. The offset voltage is within ±200µV at 25°C, with less than 5µV/°C drift, […]
Arm M3-based motor drivers carry 32k and 64k flash
TDK Corporation has expanded its Micronas embedded motor controller portfolio to address higher temperature applications. The HVC 4222F and HVC 4422F were developed for operating smart actuators in applications with ambient temperature requirements up to 150 °C. HVC 4222F offers 32k flash memory while the HVC 4422F comes with 64k flash for more complex software […]
Laser driver IC targets lidar time-of-flight apps
EPC announces the introduction of a laser driver that integrates a 40 V, 10 A FET with integrated gate driver and 3.3 logic level input in a single chip for time-of-flight lidar systems used in robotics, surveillance systems, drones, autonomous cars, and vacuum cleaners. The EPC21601 is a laser driver that is controlled using 3.3 […]
Gate-driver boards optimized for high-power modules
Silicon Labs introduced the new Si823Hx Gate Driver Board, an all-in-one isolation solution perfectly suited for the recently launched Wolfspeed WolfPACK power module. Wolfspeed power modules are used across numerous power applications, including EV chargers and motor drives in the industrial and automotive markets. Featuring the Si823Hx isolated gate driver and Si88xx digital isolator with […]
High-side current-sense amps feature 12 µV maximum offset error
With the proliferation of automation and connectivity throughout the automotive and industrial markets, the need to accurately measure a dynamic current in the presence of high-frequency noise often plagues modern vehicle and factory applications. In order to combat electrically noisy environments and address the need for higher accuracy current measurement, Microchip Technology Inc. introduced its high-side current […]
Laminated bus bars: design, fabrication, and testing considerations
The laminated bus bar (LBB) is a passive component which is used in many systems to carry power and even signals between multiple points with minimal voltage drop, power loss, and inductance. This laminated bus bar has multiple conducting layers of copper or aluminum separated by adhesive-coated insulating dielectric film. The conducting and interposed dielectric […]
